Full Low Temperature Solder BGA Development for Large size BGA Package

An open-source UFBGA µ-board for wearable devices

“…Recent fabrication strategies for new biosensors on chip solutions can be found in [8] . A relevant low temperature solder process BGA development for large size BGA packages is presented in [9] . Varied Ball BGA technology [10] is a state-of-the-art BGA improvement, to eliminate solder ball bridging defects in Surface-Mount Technology (SMT).…”