24th European Conference on Optical Communication. ECOC '98 (IEEE Cat. No.98TH8398)
DOI: 10.1109/ecoc.1998.732754
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Full duplex 1300/1550-nm-WDM optical transceiver modules for ATM-PON systems using PLC-hybrid-integration and CMOS IC technologies

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Cited by 6 publications
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“…5. It should be noted that, due to the presence of the crosstalk effects between the neighboring LED arrays [39], the outward and return signals can not be communicated at the same time in our communication systems. This issue could be addressed by building a half-duplex time-division duplexing (HD-TDD) communication system, as reported in Ref.…”
Section: Resultsmentioning
confidence: 99%
“…5. It should be noted that, due to the presence of the crosstalk effects between the neighboring LED arrays [39], the outward and return signals can not be communicated at the same time in our communication systems. This issue could be addressed by building a half-duplex time-division duplexing (HD-TDD) communication system, as reported in Ref.…”
Section: Resultsmentioning
confidence: 99%
“…Planar hybrid optical integration using, for example, silicon optical bench technology holds the promise of lowering the cost of the optical modules by simplifying the passive alignment and reducing the assembly steps; prototypes of hybrid integrated optical modules on a planar lightwave circuit (PLC) platform have been demonstrated. 23 Indeed, waveguide integration allows the realization of complex optical functions and enables the assembly of the best of both optoelectronic and integrated circuits (ICs) on the same substrate. However, the small module size achieved by hybrid integration makes achieving the required levels of optical and electrical isolation difficult.…”
Section: Component Issuesmentioning
confidence: 99%
“…For example, in an optical transceiver module using a previously reported SiO 2 waveguide, a WDM filter is inserted at the crosspoint of a curved splitter waveguide. Then based on this, the LD and PD are placed on opposite sides [2][3][4][5].…”
Section: Optical Systemmentioning
confidence: 99%
“…As the optical transceiver module becomes more compact, the communication devices must be closely packed in one package, and further crosstalk reduction becomes necessary. To satisfy these demands, research has addressed the hybrid integrated module that is unified to the SiO 2 system that formed optical and electrical devices on a silicon substrate [2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%