Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

Kwon, Young‐Tae; Lee, Young-In; Kim, Seil; Lee, Kun-Jae; Choa, Yong‐Ho

doi:10.1016/j.apsusc.2016.11.122

Cited by 38 publications

(27 citation statements)

References 24 publications

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“…[33] Fast plasma treatment of surfaces has become an extremely populara pproach. [36] Low-pressure hydrogen plasma has also been used to modify ZnO, [37] indiumdoped tin oxide, [38] TiO 2 , [39][40][41][42] aluminum-dopedz inc-tin oxide, [43] and GO. However,m ost of the investigations in This study concerns al ow-temperature method for dry hydrogen plasma reduction of inkjet-printed flexible graphene oxide (GO) electrodes, an approachc ompatible with processes envisaged for the manufacture of flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

“…Kwon et al used low-pressure hydrogen plasma for full densification of inkjet-printed copperc onductive tracks on flexible PET substrates. [36] Low-pressure hydrogen plasma has also been used to modify ZnO, [37] indiumdoped tin oxide, [38] TiO 2 , [39][40][41][42] aluminum-dopedz inc-tin oxide, [43] and GO. [7,44,45] The effects of hydrogen plasma on graphene surface chemistry have been addressed comprehensively by Felten et al [46] However,l ow-pressure plasma is not compatible with the fast, inline, roll-to-roll processes demanded by the economical manufacture of flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

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Atmospheric Dry Hydrogen Plasma Reduction of Inkjet‐Printed Flexible Graphene Oxide Electrodes

et al. 2018

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This study concerns a low-temperature method for dry hydrogen plasma reduction of inkjet-printed flexible graphene oxide (GO) electrodes, an approach compatible with processes envisaged for the manufacture of flexible electronics. The processing of GO to reduced graphene oxide (rGO) was performed in 1-64 s, and sp /sp +sp carbon concentration increased from approximately 20 % to 90 %. Since the plasma reduction was associated with an etching effect, the optimal reduction time occurred between 8 and 16 s. The surface showed good mechanical stability when deposited on polyethylene terephthalate flexible foils and significantly lower sheet resistance after plasma reduction. This method for dry plasma reduction could be important for large-area hydrogenation and reduction of GO flexible surfaces, with present and potential applications in a wide variety of emerging technologies.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Atmospheric Dry Hydrogen Plasma Reduction of Inkjet‐Printed Flexible Graphene Oxide Electrodes

et al. 2018

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“…[ 25 ] Another study significantly improved the conductivity of printed and plasma‐sintered Cu MOD ink to 55% of the bulk conductivity by using a low‐pressure RF‐powered H 2 plasma. [ 22 ]…”

Section: Schemesmentioning

confidence: 99%

Plasmas for additive manufacturing

Sui

Zorman

Sankaran

2020

Plasma Processes & Polymers

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Additive methods for manufacturing materials have recently emerged, particularly for the fabrication of three-dimensional architectures. Because of their long history in thin-film etching and deposition, plasmas offer unique advantages for many of the materials and surface processes associated with additive manufacturing. Here, we review recent efforts that have been primarily focused on the direct writing of patterned structures and the post-treatment of printed materials. Different configurations, materials, and applications are presented. Current challenges and a future outlook are also provided. 3D printing, additive manufacturing, microdischarges, nanotechnology, roll-to-roll

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“…Recently, Kwon et al 52 demonstrated a novel hydrogen plasma sintering method (150°C for 10-20 min) that achieved a full reduction and densification of inkjet-printed patterns using a Cu complex ion ink. The plasma-treated pattern showed a fully densified microstructure with a resistivity of 3.2 lX cm ( Fig.…”

Section: Ink Based On Conductive Nanomaterialsmentioning

confidence: 99%

Recent Development of Graphene-Based Ink and Other Conductive Material-Based Inks for Flexible Electronics

Saidina

Eawwiboonthanakit

Mariatti

et al. 2019

Journal of Elec Materi

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The promising and extraordinary properties of graphene have attracted significant interest, making graphene an alternative to replace many traditional materials for many applications, particularly in conductive ink for the fabrication of flexible electronics. For the past 10 years, numerous studies have been reported on the synthesis of graphene conductive ink for printing on flexible substrates for various electronic applications. The development of graphene-based ink is reviewed, with the main focus on the types of graphenelike materials in conductive inks, and the compositions and important properties of those inks. Another intention behind this review is to compare the pros and cons of graphene-based ink with those using other common conductive materials, such as gold nanoparticles, silver nanoparticles, copper nanoparticles, conductive polymers and carbon nanotubes. Recent works on graphene hybrid-based ink containing other metallic nanoparticles as an alternative way to improve the electrical properties of the conductive inks are also reported. Brief comparisons between inkjet printing and other printing techniques for the fabrication of flexible electronics are discussed.

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Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

Cited by 38 publications

References 24 publications

Atmospheric Dry Hydrogen Plasma Reduction of Inkjet‐Printed Flexible Graphene Oxide Electrodes

Atmospheric Dry Hydrogen Plasma Reduction of Inkjet‐Printed Flexible Graphene Oxide Electrodes

Plasmas for additive manufacturing

Recent Development of Graphene-Based Ink and Other Conductive Material-Based Inks for Flexible Electronics

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