Full colour RGB OLEDs on CMOS for active-matrix OLED microdisplays

Kreye, Daniel; Toerker, M.; Vogel, Uwe; Amelung, J.

doi:10.1117/12.680758

Cited by 11 publications

(6 citation statements)

References 3 publications

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“…Top‐emitting OLED structures have been fabricated onto 200‐mm Si substrates, both for the [Si/OLED] and [Si/CMOS/OLED] architectures. The highly reflective bottom anode (Al:Cu/TiN, a standard electrode material for OLED microdisplays), the top semitransparent cathode, and the organic layer thicknesses have been chosen to optimize the light extraction for a given color. White‐emitting [Si/OLED] have been studied first to test the HC impact onto OLED characteristics.…”

Section: Resultsmentioning

confidence: 99%

Curved OLED microdisplays

et al. 2019

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Technical background for CMOS substrate thinning of CEA‐LETI (historically developed for through silicon via technology as well as for more recent activity to provide curved image sensors, for IR as well as for visible spectra) has been applied to realize curved OLED‐based microdisplays. It will be shown that test OLEDs made onto silicon wafers as well as 873 × 500 WVGA, 0.38″ diagonal, and an innovative 1920 × 1200 WUXGA, 1″diagonal, CMOS‐based microdisplays can be curved at R = 45 mm radius of curvature (1D) with no negative impact onto the circuit electrical characteristics. This feature can allow significant innovation on the system and application because it can help to redesign simpler and lighter optical engine systems, in the same manner as for curved image sensors. These results can be obtained owing to the integration of a new protective hard coat layer that has been used in conjunction with a robust thin‐film encapsulation to protect OLEDs from mechanical ingress (from process steps and handling) and oxidizing gas of the atmosphere, respectively. Results have been produced within the framework of the EU‐funded, H2020 project, called Large cost‐effective OLED MIcroDisplays (LOMID and their applications).

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Section: Resultsmentioning

confidence: 99%

Curved OLED microdisplays

et al. 2019

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“…Further information can be found in. 9,11,18 projection lens Path Imaging path Measurement Imaging lens field Figure 3. Paraxial lens design of the system simulation of an 3-D sensor system.…”

Section: Bi-directional Oled Microdisplaymentioning

confidence: 99%

3D metrology system based on a bi-directional OLED microdisplay

et al. 2012

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Expanding demands on manufacturing technology increase the requirements on necessary non-contact metrology. Several optical metrology systems are based on separated imaging (e.g. camera unit) and image generating units (e.g. projection unit). This fact limits the geometrical miniaturization of the system. We present a compact, highly integrated 3-D metrology system based on the fringe projection principle using a bi-directional OLED microdisplay. The microdisplay combines light emitting pixels based on OLED technology (projection unit) and light detecting pixels based on photo diode technology (camera unit) on one single device, realized by the OLED-on-CMOS-technology. This technology provides the opportunity for a further miniaturization of optical metrology systems. The 3-D metrology system is based on fringe projection onto the surface of the measurement object. The fringes will appear deformed when observed from a dierent angle (triangulation angle). From the deformation of the fringes the 3-D coordinates of all visible points can be calculated and thus the object shape can be determined. For the application of an 3-D Sensor and due an internal display eect, separate lenses for projection and imaging are necessary. The system principle and several optical system congurations are discussed. Due to the application of the bi-directional OLED microdisplay the fringe generating elements and the detectors will be combined into one single device. Based on this integrated device an ultra-compact and solid system concept for 3-D surface metrology is practicable

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“…9,11,15 With this device, either simultaneous or sequential emission (OLED projection) and detection (photo diode) can be realized. 15 Futher, there are two different kind of BiMiDs. The first mode of operation, the OLED projection and photo diode detection is wavelength different (λ OLED λ photo diode =0).…”

Section: Bi-directional Oled Microdisplaymentioning

confidence: 99%

Optical system designs based on bi-directional sensor devices

et al. 2012

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Small and compact optical system designs are needed in nearly all application scenarios of optical projection and imaging systems, e.g. automotive, metrology, medical or multimedia. Most active optical systems are based on separated imaging (e.g. camera unit) and image generating units (e.g. projection unit). This fact limits the geometrical miniaturization of the system. We present compact optical system designs using the new technology of bi-directional sensor devices. These devices combine light emitting and light detecting elements on one single chip. The application of such innovative opto-electronic devices -so-called bi-directional OLED microdisplays (BiMiDs) -offer a huge potential for miniaturization with a simultaneous increase of performance due to a new integration step. For these new bi-directional sensor devices new optical design concepts for simultaneous and sequential emission and detection are necessary. Because the simultaneous emission and detection can disturb the functionality of the optical system. New concepts has to be applied. A first concept is an exemplary 3-D metrology system applying fringe projection. A second concept is a pico-projection system with an integrated camera function. For both concepts the system configurations and the optical design are discussed. Due to the application of the bi-directional sensor device ultra-compact systems are presented.

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Full colour RGB OLEDs on CMOS for active-matrix OLED microdisplays

Cited by 11 publications

References 3 publications

Curved OLED microdisplays

Curved OLED microdisplays

3D metrology system based on a bi-directional OLED microdisplay

Optical system designs based on bi-directional sensor devices

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