Full-Chip Implementation of IDEALSmile on 90-nm-Node Devices by ArF Lithography

Abstract

Contact holes are one of the most challenging features to be printed in the semiconductor manufacturing process. In 2002, Canon introduced a new technology, entitled innovative double effective-source aided lithography with single mask implemented lithographic enhancement (IDEALSmile), that was proven to be able to define contacts with high resolution and a sufficiently large through-pitch process window using a binary mask, modified illumination and single exposure, without any negative impact on throughput or any increase of cost of ownership. The technology was further improved in 2003 with the introduction of Enhanced IDEALSmile. STMicroelectronics, Mentor Graphics and Canon joined their competences to implement this technology to the production of devices. In this paper, we analyze the issues encountered and solutions developed to overcome problems raised in different areas. Experimental results are shown and compared with both expectations based on results of simulation and what is obtained by conventional approaches. Directions for future developments have been identified and are illustrated in their guidelines.