2022
DOI: 10.1088/1748-0221/17/04/c04018
|View full text |Cite
|
Sign up to set email alerts
|

Front-end hybrid designs for the CMS Phase-2 Upgrade towards the production phase

Abstract: Sixteen thousand 2S front-end hybrids and twelve thousand PS front-end hybrids will be produced for the CMS Tracker Phase-2 upgrade. The hybrids consist of flip-chips, passives and mechanical components mounted on a flexible substrate, laminated onto carbon-fibre stiffeners with thermal expansion compensators. In the prototyping phase, several critical issues have been solved to manufacture these complex circuits. Final designs are now reaching readiness for the full-scale production. Lessons learned during th… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
5
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
3

Relationship

2
1

Authors

Journals

citations
Cited by 3 publications
(5 citation statements)
references
References 5 publications
0
5
0
Order By: Relevance
“…Two module types (2S and PS) will be used in the OT (figure 1). The 2S modules contain a double strip sensor configuration with an active area of (10 × 10) cm 2 , wire-bonded to two front-end hybrids (FEH) [2] that are powered and controlled by a service hybrid (SEH) [3]. The PS modules contain a macro-pixel sensor bump-bonded to 16 readout application-specific integrated circuits (ASICs) and a strip sensor, both with a size of (5 × 10) cm 2 .…”
Section: The Cms Phase-2 Upgrade Outer Tracker Modulesmentioning
confidence: 99%
See 1 more Smart Citation
“…Two module types (2S and PS) will be used in the OT (figure 1). The 2S modules contain a double strip sensor configuration with an active area of (10 × 10) cm 2 , wire-bonded to two front-end hybrids (FEH) [2] that are powered and controlled by a service hybrid (SEH) [3]. The PS modules contain a macro-pixel sensor bump-bonded to 16 readout application-specific integrated circuits (ASICs) and a strip sensor, both with a size of (5 × 10) cm 2 .…”
Section: The Cms Phase-2 Upgrade Outer Tracker Modulesmentioning
confidence: 99%
“…The 2S modules contain a double strip sensor configuration with an active area of (10 × 10) cm 2 , wire-bonded to two front-end hybrids (FEH) [2] that are powered and controlled by a service hybrid (SEH) [3]. The PS modules contain a macro-pixel sensor bump-bonded to 16 readout application-specific integrated circuits (ASICs) and a strip sensor, both with a size of (5 × 10) cm 2 . Wire-bonds connect the macro-pixel ASICs and the strip sensor to two FEHs interconnected with a power hybrid (POH) on one side and with an optical readout hybrid (ROH) on the opposite side.…”
Section: The Cms Phase-2 Upgrade Outer Tracker Modulesmentioning
confidence: 99%
“…• Short and open finder procedures, which use antenna injections [5] to verify the silicon sensors input lines. Utilized by the Front-end hybrid [6] (FEH) TC (figure 2). • High voltage circuits and filters -2 -…”
Section: Jinst 19 C04040mentioning
confidence: 99%
“…Two module types (2S and PS) will be used in the CMS OT Phase-2 Upgrade. The 2S modules contain a double strip sensor configuration with an active area of (10 × 10) cm 2 , wirebonded to two front-end hybrids (FEH) [2] that are powered and controlled by a service hybrid (SEH) (Fig. 1) [3].…”
Section: The Cms Phase-2 Upgrade Outer Tracker Modulesmentioning
confidence: 99%
“…to two front-end hybrids (FEH) [2] that are powered and controlled by a service hybrid (SEH) (figure 1) [3]. The PS modules contain a strip sensor and a macro-pixel sensor of (5 × 10) cm 2 wire-bonded to two FEHs interconnected with a power hybrid (POH) on one side and with an optical readout hybrid (ROH) on the opposite side (figure 1).…”
Section: Jinst 17 C12008mentioning
confidence: 99%