From an MMIC chip to a working cryogenic low-noise amplifier: a detailed study on packaging

Valenziano, L.; Mariotti, Sergio; Armogida, A.; Baù, A.; Biggi, M.; Carbonaro, Luca; Cremonini, A.; Rosa, A. de; Gervasi, M.; Passerini, A.; Schiavone, F.; Zannoni, M.; Zuccarelli, J.

doi:10.1117/12.926143

Search citation statements

Order By: Relevance

Paper Sections

Select...

Mmic Gluing and Thermo Structural Analisys1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2014

Publication Types

Select...

Other1

Relationship

Self Cite1

Independent0

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is widely known that components gluing inside carrier is a critical process [20]. The hybrid components must stay firmly attached to the metal carrier at both room and cryogenic temperature and stand several thermal cycles to cryogenic temperature.…”

Section: Mmic Gluing and Thermo Structural Analisysmentioning

confidence: 99%

Comparison of cryogenic W band low noise amplifier based on different III-V HEMT foundry process and technologies

Valenziano¹,

Zannoni

Mariotti

et al. 2014

SPIE Proceedings

Self Cite

View full text Add to dashboard Cite

We present the results of a development activity for cryogenic Low Noise Amplifiers based on HEMT technology for\ud ground based and space-borne application. We have developed and realized two LNA design in W band, based on\ud m-HEMT technology. MMIC chips have been manufactured by European laboratories and companies and assembled in\ud test modules by our team. We compare performances with other technologies and manufacturers.\ud LNA RF properties (noise figures, S-parameters) have been measured at room and cryogenic temperature and test results\ud are reported in this paper. Performance are compared with those of state-of-the-art devices, as available in the literature.\ud Strengths and improvements of this project are also discussed.\ud Keywords: Cryogenic Low Noise amplifiers, HEMT technologies, millimetric wavelength

show abstract

Section: Mmic Gluing and Thermo Structural Analisysmentioning

confidence: 99%