Frequency of annealing twins in copper crystals grown by recrystallization

Observation of annealing twin nucleation at triple lines in nickel during grain growth

“…From Eq. (2), if c 1T < c 12 , it follows that sinh 1T < sinh 12 and, in the expected domain of 90°6 h 6 180°, this means that h 1T > h 12 . By the same argument, a reduction in boundary energy leads to h 3T > h 23 .…”

“…The first is that twins form when crystals that already have a twin relationship impinge during growth [11,12]. The second assumes that a twin forms when growth occurs and a layer of atoms on the (1 1 1) plane is misplaced in the twin relationship; further growth on this misplaced layer leads to a twinned crystal [13][14][15][16].…”

Local Crystallographic Orientation Correlation Measurements Connecting the Processing and Properties of Face-Centered Cubic Metals

“…Phenomenologically, their areal density is known to increase with low stacking fault energy, low prior grain size and high prior cold work [60]. Four groups of models have been proposed for the origin of these so-called annealing twins, growth accidents [61][62][63], stacking fault packets [63,64], grain encounters [65], and grain boundary dissociation [66][67][68].…”

“…Both the growth accident and stacking fault packet model may also be applied to twins that form during atomic deposition processes like electrodeposition or physical vapor deposition. The grain encounter model postulates that twins form when growing grains of the proper misorientation impinge upon one another [65]. This model cannot explain the frequency of annealing twinning [69].…”

Grain size dependence of the twin length fraction in nanocrystalline Cu thin films via transmission electron microscopy based orientation mapping

“…Burgers also proposes that the annealing twin density in fcc materials is dependent of the orientation relationship between the growing crystal and the matrix 29 .…”