2005
DOI: 10.1016/j.sna.2005.01.012
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Free-standing SU-8 microfluidic chips by adhesive bonding and release etching

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Cited by 108 publications
(96 citation statements)
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“…SU-8 is simple to pattern by photolithography, 17 can readily be bonded to itself, 18 and offers a reasonable combination of mechanical strength and chemical tolerance. For example, the mechanical properties of SU-8 have been exploited to make check valves.…”
Section: B Exploration Of Alternative Polymeric Materialsmentioning
confidence: 99%
“…SU-8 is simple to pattern by photolithography, 17 can readily be bonded to itself, 18 and offers a reasonable combination of mechanical strength and chemical tolerance. For example, the mechanical properties of SU-8 have been exploited to make check valves.…”
Section: B Exploration Of Alternative Polymeric Materialsmentioning
confidence: 99%
“…The amount of liquid SU8-100 for bonding is determined by minimizing void formation and at the same time reducing the overflow of the material during bonding. A good bonding temperature is 65 0 C which is just above the glass transition temperature (64 0 C) of the SU8 material but not high enough to cause significant overflow as the viscosity changes rapidly around the glass temperature (Tuomikoski and Franssila, 2005). …”
Section: Antenna Assemblymentioning
confidence: 99%
“…Thicknesses of SU-8 range from sub-micrometer to hundreds of micrometers. SU-8 is easily bondable to itself [4], making it easy to fabricate devices that are completely made of SU-8, which is important for applications where surface charge or adsorptions are important. SU-8 is a negative resist which is exposed with wavelength of 365 nm typically in 1× mask aligner.…”
Section: Introductionmentioning
confidence: 99%