Fracture Toughness of Elastomer Modified Epoxy Adhesives

Donatelli, Alfred A.; Mooney, Corey; Bolger, Justin C.

doi:10.1007/978-1-4613-2749-3_47

Cited by 5 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It can be clarified that the EPN/PPGDE compositions that containing higher concentrations of CTBN rubber initiated to the adhesive strength was found to continuously decrease with increasing CTBN mass content. At higher loadings of CTBN, the rubber behaved gather that resulting in the loss of adhesive strength of the epoxy system[48,53].However, EPN/PPGDE/CTBN blends presents the adhesive failure on aluminum substrate. Whereas, the adhesion characteristic of EPN/PPGDE blends exhibits PI film adhesive failure.…”

mentioning

confidence: 99%

Development of epoxy adhesive for screen printing on aluminum of flexible printed circuit

Leeium

View full text Add to dashboard Cite

The aim of this research is to develop epoxy based adhesive for screen printing on aluminum (Al) and polyimide (PI) substrates in flexible printed circuit (FPC) manufacturing. Two types of aromatic epoxy resins are evaluated in this work including diglycidyl ether of bisphenol-A (DGEBA) and epoxy phenolic novolacs (EPN). The two epoxy resins will also be blended with aliphatic epoxy (PPGDE) for adhesive property enhancement purpose. These epoxy systems can be cured at 170oC for 15 min using metaphenylene diamine (m-PDA) as a curing agent. The compositions of the aromatics epoxies were varied in a range of 50 to 90wt%. From the results, it was found that peel strength of EPN/PPGDE blends was higher than peel strength obtained from DGEBA/PPGDE systems. The maximum peel strength of EPN/PPGDE blends was measured to be 0.561 N/mm at 50/50 mass ratio. These blends were also found to show outstanding adhesive bonding with the aluminum substrate. In addition, it was also found that when the EPN/PPGDE blend at 50/50 mass ratio was modified with 5 phr of CTBN rubber, the resulting adhesive exhibited a good bonding with polyimide substrate providing maximum peel strength of about 0.706 N/mm. The above results also suggest difference in bonding mechanisms of the two adhesive layers and the Al or PI substrates. Consequently, two adhesive layers of epoxy systems with the first layer of EPN/PPGDE blend was applied on Al substrate whereas the CTBN modified EPN/PPGDE blend, a second adhesive layer, which provides a good adhesion on PI film was casted on top of the EPN/PPGDE layer. The obtained peel strength of this two-layered epoxy blends was found to be as high as 0.813 N/mm meeting the industrial requirement. These two-layered epoxy adhesive systems are a good candidate for adhesive bonding of Al and PI substrates through screening printing process.

show abstract

mentioning

confidence: 99%

Development of epoxy adhesive for screen printing on aluminum of flexible printed circuit

Leeium

View full text Add to dashboard Cite

show abstract

Carboxyl‐terminated poly(propylene glycol) adipate‐modified room temperature curing epoxy adhesive for elevated temperature service environment

Achary

Gouri

Ramaswamy

1991

J of Applied Polymer Sci

View full text Add to dashboard Cite

SYNOPSISAn investigation was carried out into the effect of modification of an epoxy resin with carboxyl-terminated poly (propylene glycol) adipate ( CTPPGA) liquid rubber, on room temperature and elevated temperature adhesive joint strengths, after curing at room temperature (25°C) with tris-2,4,6-(N,N-dimethyl amino methyl) phenol hardner. CTPPGA prepared by the esterification of poly(propy1ene glycol) (PPG) and molar excess of adipic acid was incorporated into the epoxy resin by the prereact method. CTPPGA modification showed significant enhancement of adhesive joint strengths over the unmodified epoxy and the joint strengths were found to depend on the molecular weight of CTPPGA and its content in the epoxy resin. The elevated temperature lap shear strength measurement made for the CTPPGA-modified epoxy adhesive showed that the adhesive formulation has a temperature service capability up to 120°C. The results are discussed in terms of the data obtained from the tensile tests, DSC analysis, and SEM observations of the fractured surfaces.

show abstract

The Effect of Modification of an Epoxy Resin Adhesive with ATBN on Peel Strength

Nakao

Yamanaka

1992

The Journal of Adhesion

View full text Add to dashboard Cite

Fracture Toughness of Elastomer Modified Epoxy Adhesives

Cited by 5 publications

References 3 publications

Development of epoxy adhesive for screen printing on aluminum of flexible printed circuit

Development of epoxy adhesive for screen printing on aluminum of flexible printed circuit

Carboxyl‐terminated poly(propylene glycol) adipate‐modified room temperature curing epoxy adhesive for elevated temperature service environment

The Effect of Modification of an Epoxy Resin Adhesive with ATBN on Peel Strength

Contact Info

Product

Resources

About