Fracture toughness of Cu–EMC interfaces in pressurized steam

Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations

“…The experimental results also show that 4PB is a viable method for measuring interface adhesion energy of PCB materials. The calculated values for the critical energy release rate are within the typical range for metal-polymer interfaces [15,31]. However the application of the method requires a huge sample size of tests if the interface of interest is not the weakest inside the multilayer build-up.…”

“…These methods are all based on mechanical or thermo-mechanical theories and have been successfully applied to a variety of interfaces [16][17][18][19][20][21][22][23][24][25][26][27][28][29]. Of the mentioned techniques, 4-point bending (4PB) was found to be suitable to determine the steady state energy release rate (adhesion energy) between different kinds of metal-dielectric interfaces [30][31][32][33][34]. The 4PB test is highly valuable for studying multilayer systems because the interfaces of interest are sandwiched between two elastic substrates.…”