Fracture toughness and fatigue crack growth characteristics of nanotwinned copper

Singh, Aparna; Tang, Lisa; Dao, Ming; Lü, Lei; Suresh, S.

doi:10.1016/j.actamat.2010.12.043

Cited by 164 publications

(75 citation statements)

References 48 publications

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“…In epitaxial nanotwinned Cu, growth twin lamellae have long CTBs normal to the growth direction, and truncated by short SITBs [31,32,34]. The nanotwinned Cu has been shown to exhibit a superior combination of ultrahigh strength, low electrical resistance, good ductility, high thermal stability, and fatigue resistance [31][32][33][34][35][36][37][38][39][40]. The unusual mechanical properties of nanotwinned Cu originate from CTBs, which act as strong barriers to slip transfer of single dislocations (thus, enhancing strength), and simultaneously create more local sites for nucleating and accommodating dislocations (thus, elevating ductility and improving work hardening) [31].…”

Section: Introductionmentioning

confidence: 99%

“…Recently, Σ3{111} coherent twin boundaries (CTBs) and Σ3{112} symmetric incoherent twin boundaries (SITBs) have attracted considerable attention, since they often form during fabrication of as growth twins and play a crucial role in the mechanical performance of nanotwinned metals [30][31][32][33][34][35][36][37][38][39][40][41][42]. In epitaxial nanotwinned Cu, growth twin lamellae have long CTBs normal to the growth direction, and truncated by short SITBs [31,32,34].…”

Section: Introductionmentioning

confidence: 99%

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Deformation and spallation of shocked Cu bicrystals withΣ3 coherent and symmetric incoherent twin boundaries

Han

Luo

et al. 2012

Phys. Rev. B

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We perform molecular dynamics simulations of Cu bicrystals with two important GBs, Σ3 coherent twin boundaries (CTB) and symmetric incoherent twin boundaries (SITB), under planar shock wave loading. It is revealed that the shock response (deformation and spallation) of the Cu bicrystals strongly depends on the GB characteristics. At the shock compression stage, elastic shock wave can readily trigger GB plasticity at SITB but not at CTB. The SITB can induce considerable wave attenuation such as the elastic precursor decay via activating GB dislocations. For example, our simulations of a Cu multilayer structure with 53 SITBs (~1.5 µm thick) demonstrate a ~80% elastic shock decay. At the tension stage, spallation tends to occur at CTB but not at SITB due to the high mobility of SITB. The SITB region transforms into a threefold twin via a sequential partial dislocation slip mechanism, while CTB preserves its integrity before spallation. In addition, deformation twinning is a mechanism for inducing surface step during shock tension stage. The drastically different shock response of CTB and SITB could in principle be exploited for, or benefit, interface engineering and materials design.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Deformation and spallation of shocked Cu bicrystals withΣ3 coherent and symmetric incoherent twin boundaries

Han

Luo

et al. 2012

Phys. Rev. B

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“…[77][78][79][80] The exceptional torsion capability of nanowires is accessible by domino detwinning. 81 Also, both the experimental and computational studies on various properties of materials, such as friction, 82 fracture, [83][84][85] fatigue, 83,85-90 creep 85,91 and corrosion, 92 are promoting the understanding of NT materials. The experimental [93][94][95][96][97] and MD studies [98][99][100] of NT structures have demonstrated that they are also beneficial to the adsorption of irradiation-induced defects, and thus can effectively reduce the irradiation hardening effect and keep good ductility.…”

Section: Introductionmentioning

confidence: 99%

Nanotwinned and hierarchical nanotwinned metals: a review of experimental, computational and theoretical efforts

Sun

2018

npj Comput Mater

122

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The recent studies on nanotwinned (NT) and hierarchical nanotwinned (HNT) face-centered cubic (FCC) metals are presented in this review. The HNT structures have been supposed as a kind of novel structure to bring about higher strength/ductility than NT counterparts in crystalline materials. We primarily focus on the recent developments of the experimental, atomistic and theoretical studies on the NT and HNT structures in the metallic materials. Some advanced bottom-up and top-down techniques for the fabrication of NT and HNT structures are introduced. The deformation induced HNT structures are available by virtue of severe plastic deformation (SPD) based techniques while the synthesis of growth HNT structures is so far almost unavailable. In addition, some representative molecular dynamics (MD) studies on the NT and HNT FCC metals unveil that the nanoscale effects such as twin spacing, grain size and plastic anisotropy greatly alter the performance of NT and HNT metals. The HNT structures may initiate unique phenomena in comparison with the NT ones. Furthermore, based on the phenomena and mechanisms revealed by experimental and MD simulation observations, a series of theoretical models have been proposed. They are effective to describe the mechanical behaviors of NT and HNT metals within the applicable scope. So far the development of manufacturing technologies of HNT structures, as well as the studies on the effects of HNT structures on the properties of metals are still in its infancy. Further exploration is required to promote the design of advanced materials.

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“…For reliability of these parts, it is necessary to estimate the fatigue properties of the film materials, of which mechanical properties will be different from those of bulk materials used as relatively large-sized components of machines. However, since fatigue testing presents a serious difficulty with regard to gripping small specimens, the fatigue crack propagation behavior of the freestanding film specimen have been hardly discussed (Singh, et al, 2011 andKondo, et al, 2012). Especially, the threshold stress intensity factor range, DKth, is difficult to estimate because more accurate load control in the load shedding process is necessary in comparison with the bulk materials (Bartosiewicz, et al, 1992, Zhao, et al, 1999, Hadrboletz, et al, 2001and Kondo, et al, 2014.…”

Section: Introductionmentioning

confidence: 99%

Development of <i>ΔK</i>-decreasing test method of the metal film by displacement constraint along the elliptical through hole-edge

Shimizu

Kato

Sakata

2016

Mechanical Engineering Journal

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A new DK-decreasing test method of the metal film was developed. The film was adhered to a through elliptical hole in a base plate and was fatigued in accordance with the displacement constraint along the hole -circumference in the base plate subjected to a cyclic stress. Commonly, a stress intensity factor range was increased with a crack propagation under a constant stress amplitude but was decreased toward the hole-edge because of the difference in thickness between the film and the base plate in this DK-decreasing test method.The decrease in a stress intensity factor with a crack propagation was calculated by FEM analysis and the optimum aspect ratio of an elliptical hole was determined. Using the DK-decreasing test method, the crack propagation test was conducted for metal films. As a result, the fatigue crack propagation rate was decreased and was arrested near the hole-edge under the constant stress amplitude to the base plate. The threshold stress intensity factor ranges were obtained for some kinds of metal film and the accuracy of the testing method was discussed.

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Fracture toughness and fatigue crack growth characteristics of nanotwinned copper

Cited by 164 publications

References 48 publications

Deformation and spallation of shocked Cu bicrystals withΣ3 coherent and symmetric incoherent twin boundaries

Deformation and spallation of shocked Cu bicrystals withΣ3 coherent and symmetric incoherent twin boundaries

Nanotwinned and hierarchical nanotwinned metals: a review of experimental, computational and theoretical efforts

Development of <i>ΔK</i>-decreasing test method of the metal film by displacement constraint along the elliptical through hole-edge

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