Fracture strength and fatigue of polysilicon determined by a novel thermal actuator [MEMS]

Kapels, H.; Aigner, Robert; Binder, J.

doi:10.1109/16.848302

Cited by 99 publications

(68 citation statements)

References 16 publications

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“…Stress-life fatigue data were also reported by Kapels, Aigner and Binder [40] on 4 µm thick polysilicon. These authors used Weibull statistics to determine a mean fracture strength of their tensile specimens of 2.9±0.5 GPa, with a Weibull modulus of 6.4 ± 1.…”

Section: Figurementioning

confidence: 69%

“…Based on a wide spectrum of studies (listed in Tables 1 and 2) involving a range of different testing methods (described in the Appendix), stress-lifetime data (Figures 1, 10) for thin-film silicon show relatively consistent trends, specifically that stress amplitudes as low as half the (single-cycle) fracture stress can cause delayed fatigue failure, typically after 10 11 cycles or more [11,24,31,33,48] . Such fatigue failure has been reported for various modes of cyclic loading, specifically for fully reversed cyclic loading (R = -1) [4,[11][12][13][14][15]18,19,24,[30][31][32][33][34][35][41][42][43]48,49,[52][53][54]59] and tensile loading with a positive mean stress (R ≥ 0) [13,[21][22][23][25][26][27][28][29][33][34][35]40,[55]…”

Section: Discussionmentioning

confidence: 99%

“…A different type of polysilicon actuator was employed by Kapels, Aigner and Binder [40] , consisting of an electrically powered thermal actuator. Their actuator consisted of two narrow beams (of different lengths) that expanded due to electrical heating, and a cold plate to which a short beam (the specimen) was attached.…”

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confidence: 99%

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Mechanisms for Fatigue of Micron‐Scale Silicon Structural Films

et al. 2007

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SummaryAlthough bulk silicon is not susceptible to fatigue, micron-scale silicon is. Several mechanisms have been proposed to explain this surprising behavior although the issue remains contentious. Here we describe published fatigue results for micron-scale thin silicon films and find that in general they display similar trends, in that lower cyclic stresses result in larger number of cycles to failure in stress-lifetime data. We further show that one of two classes of mechanisms is invariably proposed to explain the phenomenon. The first class attributes fatigue to a surface effect caused by subcritical (stable) cracking in the silicon-oxide layer, e.g., reaction-layer fatigue; the second class proposes that subcritical cracking in the silicon itself is the cause of fatigue in Si films. It is our contention that results to date from single and poly crystalline silicon fatigue studies provide no convincing experimental evidence to support subcritical cracking in the silicon. Conversely, the reaction-layer mechanism is consistent with existing experimental results, and moreover provides a rational explanation for the marked difference in fatigue behavior of bulk and micron-scale silicon.

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Section: Figurementioning

confidence: 69%

Section: Discussionmentioning

confidence: 99%

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Mechanisms for Fatigue of Micron‐Scale Silicon Structural Films

et al. 2007

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“…The upper limit of 400 MPa is imposed for the reliability of the polysilicon suspension. The fracture strength of polysilicon is reported to be a few gigapascals [7]; however, this threshold may be lowered during postprocessing and also, stresses may locally be higher in reality than in simulation. From our experience, we consider 400 MPa to be an upper limit for safe operation.…”

Section: Modelingmentioning

confidence: 99%

Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

Waldis

Zamkotsian

Clerc

et al. 2007

IEEE J. Select. Topics Quantum Electron.

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Abstract-Micromirror arrays are promising components for generating reflective slit masks in future multiobject spectrographs. The micromirrors, 100 µm × 200 µm in size, are etched in bulk single crystal silicon, whereas a hidden suspension is realized by surface micromachining. The micromirrors are actuated electrostatically by electrodes located on a second chip. The use of silicon on insulator (SOI) wafers for both mirror and electrode chip ensures thermal compatibility for cryogenic operation. A system of multiple landing beams has been developed, which latches the mirror at a well-defined tilt angle when actuated. Arrays of 5 × 5 micromirrors have been realized. The tilt angle obtained is 20• at a pull-in voltage of 90 V. Measurements with an optical profiler showed that the tilt angle of the actuated and locked mirror is stable with a precision of 1 arcmin over a range of 15 V. This locking system makes the tilt angle independent from process variations across the wafer and, thus, provides uniform tilt angle over the whole array. The surface quality of the mirrors in actuated state is better than 10-nm peak to valley and the local roughness is about 1-nm root mean square.Index Terms-Deep reactive-ion etch (DRIE), micromirror, microoptoelectromechanical system (MOEMS), mirror array, multiobject spectroscopy (MOS).

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“…Methods in this group have been developed either for silicon and polysilicon [1,2] or metals [3,4,5]. The other group is the on-chip fatigue test method [6,7,8,9]. In this method microspecimen is fabricated with a microactuator on a chip so this group of methods are free from human error involved in fixing and alignment of microspecimen to the actuator or the test device.…”

Section: Introductionmentioning

confidence: 99%

High-frequency fatigue test of metallic thin films using PVDF microactuator

Tamjidi

Sato

Suzaki

et al. 2012

IEICE Electron. Express

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Novel high-frequency bending fatigue test method for sputtered metallic thin films using PVDF microactuator is proposed. Thin film titanium specimen as an example and a PVDF piezoelectric microactuator are fabricated. The specimen is stamped on this actuator and the actuator is vibrated at its resonance frequency until the specimen fails by fatigue. The stress in the specimen is calculated from vibration amplitude. By using the proposed method, the stress-fatigue life cycle (S-N) curve of the thin film titanium is obtained over 50 times faster than conventional method. Keywords: fatigue test, thin film, S-N curve, resonance, PVDF, titanium Classification: Micro-or nano-electromechanical systems References

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Fracture strength and fatigue of polysilicon determined by a novel thermal actuator [MEMS]

Cited by 99 publications

References 16 publications

Mechanisms for Fatigue of Micron‐Scale Silicon Structural Films

Mechanisms for Fatigue of Micron‐Scale Silicon Structural Films

Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

High-frequency fatigue test of metallic thin films using PVDF microactuator

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