Fracture force analysis at the interface of Pd and SrTiO3

Nazarpour, Soroush; Zamani, Cyrus; Cirera, A.

doi:10.1016/j.apsusc.2009.01.071

Cited by 3 publications

(4 citation statements)

References 15 publications

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“…Afterwards, repetitive contacts at a single point were obtained by oscillating the specimen against indenter that is mounted on a freely swinging pendulum. The process has been described in [21]. Afterwards, stress was measured in -tilt mode from 0º to 180º (2 = 38º -42º) in order to plot the d-spacing versus Sin 2 .…”

Section: Experimental Methodsmentioning

confidence: 99%

“…h t is the total depth of indentation and h i is piling up height. It has been shown previously [21] that the ratio between h t and h i is constant by increasing the applied load until a critical value. Indeed, this critical value is critical fracture force.…”

Section: Fig 3 Represents Hardness and Elastic Module Of The Depositementioning

confidence: 99%

“…This reveals the importance of measuring the critical fracture force during indentation [21]. Another potential problem is that this method was deduced from a purely elastic contact model for monolithic material.…”

Section: Fig 3 Represents Hardness and Elastic Module Of The Depositementioning

confidence: 99%

“…In order to solve this problem, various researchers [17][18][19][20] have deposited thick overlayers capable of accumulating large amount of strain energy over the interface. In our previous work [21], a new method was introduced based on the oscillating indentation to accurately measure the critical fracture force in Pd thin films. In this article, the critical fracture force has been described as a critical force that indenter fractures the film and reaches to the interface without indenting the substrate.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses

Nazarpour¹,

Cirera²

2010

J. Phys. D: Appl. Phys.

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Initially, Pd thin films were deposited over a hard substrate using electron beam physical vapor deposition. The growth and the surface roughness of the films were analyzed and their effects upon conventional indentation test were discussed.Afterwards, an experimental method is described which can measure the critical fracture force in thin films using oscillating indentation. Initially, repetitive contacts at a single point with the purpose of identifying the fracture time provide the fracture force versus fracture time plot. Non-linear curve fitting of the data reveals the theoretical fracture force by a single indentation, which is called critical fracture force. Arguments are put forth to show the relation between piling up height and applied force. Discrepancies were observed in the plot of the ratio between total indentation depth and pilling up height versus applied force when higher loads than critical fracture force were applied.Discrepancies appear as a result of indenting the substrate. Nanoscratch test facilitated the possibility to measure adhesion strength and adhesion energy of the films considering measured critical fracture force as maximum applied force. The relation between residual compressive stresses, adhesion strength, plastic deformation, and pilling up area was discussed using dislocation theories. Indentation with high applied load leaves behind large plastic deformation and reduces the accuracy and reliability of the test results. Hence, lower loads (in the order of nN) were applied using Atomic Force Microscopy in the friction mode. Pulling off force was mapped in each thickness Confidential: not for distribution. Submitted to IOP Publishing for peer review 28 July 2010 of Pd films. The results confirm that the area around a hillock exhibits higher pulling off force due to the local stress relaxation as a consequence of hillock formation. By repeating the mapping process over different area with various applying forces, the plot of the pulling off force versus applied load was drawn representing discrepancies in the results at higher loads. This phenomenon is associated with the plastic deformation in the films.

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Section: Experimental Methodsmentioning

confidence: 99%

Section: Fig 3 Represents Hardness and Elastic Module Of The Depositementioning

confidence: 99%

Section: Fig 3 Represents Hardness and Elastic Module Of The Depositementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses

Nazarpour¹,

Cirera²

2010

J. Phys. D: Appl. Phys.

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Selvedge layer in the interface of Pd thin film with YSZ substrate

Nazarpour

Chaker

2012

Surface and Coatings Technology

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Survey of the theory and experimental measurements of residual stress in Pd thin film

Afshar

Nazarpour

Cirera

2010

Journal of Applied Physics

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Different thicknesses of Pd thin film were deposited over SrTiO3 by electron beam physical vapor deposition. Residual stress for each thickness of Pd film was computed by applying conventional x-ray diffraction method and taking into account Poisson’s ratio and elastic module measured by Nanoindentation. We observed that Pd stress variation at 300 °C substrate temperature obeys the trend of type II metals with high adatom mobility. Several models alluded in the literature were compared to the stress variation of the Pd films. Two models, namely; Freund–Chason and Guisbiers–Van Overschelde–Wautelet were found to be in agreement with the experimental results in that for the thicknesses less than 30 nm, Guisbiers–Van Overschelde–Wautelet is dominant but for higher than 30 nm, variation in stress follows Freund–Chason model. Therefore, the thickness around 30 nm could be considered as coalescence thickness. Surprisingly, this transition thickness is the same thickness that Guisbiers–Van Overschelde–Wautelet and Freund–Chason models intersect. Negligible residual stress and high conductance of 30 nm Pd thin film reveal the importance of this transition thickness in microelectronic technology.

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Fracture force analysis at the interface of Pd and SrTiO3

Cited by 3 publications

References 15 publications

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses

Selvedge layer in the interface of Pd thin film with YSZ substrate

Survey of the theory and experimental measurements of residual stress in Pd thin film

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Fracture force analysis at the interface of Pd and SrTiO3

Cited by 3 publications

References 15 publications

Variation of adhesive force at the interface of Pd and SrTiO3 as a consequence of residual stresses

Variation of adhesive force at the interface of Pd and SrTiO3 as a consequence of residual stresses

Selvedge layer in the interface of Pd thin film with YSZ substrate

Survey of the theory and experimental measurements of residual stress in Pd thin film

Contact Info

Product

Resources

About

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses

Variation of adhesive force at the interface of Pd and SrTiO₃ as a consequence of residual stresses