Fracture behavior and characterization of free-standing metal silicide thin films

Shafikov, Airat

doi:10.3990/1.9789036554251

Cited by 1 publication

(1 citation statement)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In contrast to the temperature trends observed for the pellicle structure, the overall thermal stress of the metal-silicide core pellicle is higher than that of the poly-silicon core pellicle. The UTS of ZrSi₂ and MoSi₂ are 6.5 GPa and 10 GPa, respectively, which are significantly higher than the UTS of 1.3 GPa of poly-silicon [5][6]. This means that metal-silicide pellicles made from ZrSi₂ or MoSi₂ are more resistant to mechanical stress and can withstand greater forces before breaking than poly-silicon pellicles.…”

Section: Thermal Stress For Different Structuresmentioning

confidence: 93%

Effect of particle defect to extreme ultra-violet pellicle

Jeon

Kang

et al. 2023

Optical and EUV Nanolithography XXXVI

View full text Add to dashboard Cite

The extreme ultraviolet (EUV) pellicle on the EUV mask is used to prevent the image distortion, and the lifetime of the pellicle is important because it is directly related to the yield. However, particle defects can significantly impact the lifetime of the pellicle, causing thermal or mechanical damage such as deformation or increased temperature. To study these effects, we explored how particle defects affect the pellicle, including scenarios where defects on the pellicle or collide with it. We found that there was no temperature and stress accumulation with repeated exposure of the pellicle regardless of the defect exitance. The collision of flying particles gave little mechanical effect with the known impulse inside the scanner. The metal-silicide core pellicles showed better thermal stability compared to the poly-silicon core pellicles and that could be the reason why metal-silicide pellicles showed longer lifetime.

show abstract

Section: Thermal Stress For Different Structuresmentioning

confidence: 93%