2019
DOI: 10.1007/s10853-019-03893-y
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Fracture and toughening mechanisms of silica- and core–shell rubber-toughened epoxy at ambient and low temperature

Abstract: The highly cross-linked thermosetting polymers used as adhesives and as the matrices of fibre composites for the construction of lightweight vehicles are very brittle, and finding effective toughening solutions for such engineering applications is a long-standing problem. An anhydride-cured thermosetting epoxy polymer has been modified by the addition of different wt% of silica nanoparticles, core-shell rubber particles and hybrids with equal wt% of both. The fracture energy was measured at ambient and low tem… Show more

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Cited by 54 publications
(22 citation statements)
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“…Tsang et al based their study of an anhydride-cured DGEBA on a combination of silica nanoparticles and a core shell rubber Type II [ 38 ]. Fracture behavior at −80 °C, −40 °C and ambient temperature was tested.…”
Section: Epoxy Resins Modified With Silica Nanoparticlesmentioning
confidence: 99%
“…Tsang et al based their study of an anhydride-cured DGEBA on a combination of silica nanoparticles and a core shell rubber Type II [ 38 ]. Fracture behavior at −80 °C, −40 °C and ambient temperature was tested.…”
Section: Epoxy Resins Modified With Silica Nanoparticlesmentioning
confidence: 99%
“…However, conventional studies on CSR nanoparticle/epoxy composite polymers have mainly considered the mechanical properties at room temperature. A number of studies have characterized the properties of the CSR/epoxy at cryogenic temperatures (at 77 K under LN 2 ambient conditions) [ 38 , 39 ] and low temperatures (from −109 to 20 °C) [ 40 , 41 , 42 ], but these studies are rare. Nevertheless, this temperature range is only a partial intersection of the operating temperature range required for the automotive industry, which presents insufficient information for structural adhesive manufacturing.…”
Section: Introductionmentioning
confidence: 99%
“…liquid rubbers and CSIMPs) could endanger signi cant improvement in the toughness of epoxy resin through various mechanisms such as deboning, cavitation, and crazing [6,8]. Nonetheless, incorporation of such IMPs in epoxy formulation could result in deterioration of other desired properties of the host polymer (such as modulus, stiffness, and tensile strength) [9]. On the other hand, rigid IMPs not only could enhance the toughness of epoxy resin by crack pinning, crack de ection and de ection/bifurcation effect of growing crack, but also could boost stiffness and modulus of the host polymer [10].…”
Section: Introductionmentioning
confidence: 99%