Fracture Analysis of Griffith Interface Crack in Fine-Grained Piezoelectric Coating/Substrate under Thermal Loading

Abstract

Coating often plays a role in monitoring and protecting substrates in engineering applications. Interface cracks between the coating and the substrate can lead to crack growth under the action of external loading and will cause device failure. In this paper, the behavior of a fine-grained piezoelectric coating/substrate with a Griffith interface crack under steady-state thermal loading is studied. The temperature field, displacement field, and electric field of the coupling of thermal and electromechanical problems are constructed via integral transformation and the principle of superposition. Thus, problems are transformed into a system of singular integral equations, and the expressions of thermal intensity factor, thermal stress intensity factor, and electric displacement intensity factor are obtained. We used a numerical calculation and a system of singular equations to obtain the relationship of strength factor with material parameters, coating thickness, and crack size.

Transient Response of Multiple Interface Cracks in Fine-Grained Coating Composite Structures under Impact Loading

“…From the above overview, at present, most of the theoretical research on defects in piezoelectric materials remains at the normal grain size, but there is relatively little theoretical research on interface defects in fine-grained dielectric materials [20][21][22]. At the same time, the mechanical, dielectric, and piezoelectric properties of fine-grained piezoelectric materials are uncertain due to differences in grain size and preparation conditions, and the relationship between them has been mostly analyzed from an experimental perspective [23,24].…”

Modelling and Investigation of the Dynamic Behavior of a Penny-Shaped Interface Crack in Piezoelectric Bimaterials

“…Based on the above situation, research on the fracture mechanics of piezoelectric ceramics has received attention from the experts [5][6][7][8][9][10][11][12][13]. Influence of incomplete bonding on the dynamic response of prestressed sandwich plate-strip with elastic layers and a piezoelectric core was studied by Daşdemir [14].…”