Fractality and roughness of the ZnO:Cu composite thin films annealed in different temperatures

Babaei

et al. 2020

Surface Engineering

Titanium chromium nitride (TiCrN) films were prepared under various nitrogen flow rates (7-18 sccm) via co-sputtering. It was argued that the target poisoning effect governs the deposition process in nitrogen-rich atmospheres. The observed X-ray diffraction patterns suggested that the crystal structure of TiCrN coatings is a cubic close-packed (TiCr)N solid solution with (111) crystalline planes. The patterns also implied that the increased nitrogen content is accompanied by a tendency towards crystallite size enlargement. In addition to the main vibrational transitions, the micro-Raman spectroscopy detected the Raman third-order vibrational transition (2A + O) and a peak corresponding to one of the Raman second-order transitions (A + O). It was also revealed that the area under the peaks corresponding to chromium nitride first-order and second-order acoustic vibrational transitions increase with the increase in the nitrogen content of the samples. Ultraviolet-visible spectroscopy showed that the coatings can have a potential application in under-marine UV photodetector designs.

Section: Introductionmentioning

confidence: 99%

Raman and ultraviolet–visible spectroscopy of titanium chromium nitride thin films

Babaei

et al. 2020

Surface Engineering

“…Electroless nickel has phosphorus since it uses sodium hypophosphite as a reducing agent, making it amorphous [155]. During annealing, notable changes occur in the properties and the crystal structure of the seed layer [156-161]. A crystalline structure appears as the grain boundaries disappear, improving adhesion.…”

Section: Various Adhesion Improvement Techniques Of Electroless Coppe...mentioning

confidence: 99%

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

Surface Engineering

This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.

Microscopy Res & Technique

“…In recent years, the synthesis methods of thin films have expanded, so various techniques including chemical vapor deposition, sputtering, sol–gel, physical evaporation, have been proposed for the synthesis of these films (Abdullayeva et al, 2019; Bussetti et al, 2014; Hirao et al, 2008). Among these methods, sputtering has been considered due to the lack of sample contamination, high process speed, film uniformity, and accuracy of work, and so on (Haji Abdolvahab et al, 2020). Nickel oxide (NiO) is one of the metal oxides that have been used from the past to the present, which is one of the materials used in the manufacture of electronic components such as transistors due to its high sensitivity, high electron transfer speed, low cost (Barir et al, 2017; Majd et al, 2017; Majd et al, 2018).…”

Section: Introductionmentioning

confidence: 99%

Surface characterization of NiO thin films deposited by RF‐magnetron sputtering at different thickness: Statistical and multifractal approach

Astinchap

Awrang

Norian

2022

Fractal and multifractal are the most important processes and concepts in describing and examining surface morphology, and for this reason, these concepts are an important approach for analyzing the properties and surface geometry of thin films. In this article, multifractal analysis was performed on images, prepared using atomic force microscopy (AFM), of the surface morphology of nickel oxide thin films deposited by RF‐Magnetron sputtering at different thicknesses on the glass substrate. The effect of thickness on the surface properties of the layers was studied by applying multifractal and statistical methods on AFM images. The results obtained from the multifractal spectrum show that the surface of the nickel oxide thin films deposited at different thicknesses are multifractal. The multifractal analysis demonstrated that multifractality and complexity of the surface of nickel oxide thin films changes and decrease with thicknesses. We also used statistical parameters to better examine AFM images to study the effects of layers thickness on the deposited NiO thin films. The results indicated that the statistical parameters are a function of the layer's thickness of NiO thin films. Hence, the isotropic properties and functional parameters changed with changing surface thickness. Research Highlights Multifractal analysis was applied to the AFM images to study the surface morphology of NiO thin films. The multifractal nature of the surface of NiO thin films is observed. The layers have become more isotropic with increasing thickness. The results illustrated that deposition masses occurred more at the highest sites on the surface. Multifractality of the surface of the sample decreased with increasing layer thickness.