Fractal contact behavior of single crystal copper substrate and rigid plane

Dai, Yuyu; Lin, Jia; Huang, Jianmeng

doi:10.1080/01932691.2019.1627881

Cited by 3 publications

(2 citation statements)

References 23 publications

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“…Since the range of asperity size is from 1E-9 m to 1E-3 m [79] that this smaller than the contact body size, the contact between two rough surfaces [5]is equivalented to the contact between a rigid smooth plane and a rough surface in Fig. 1 (d) [80]. (R1 and R2 are the radii of the contact bodies, O1 and O2 are the geometrical centers of the contact bodies, R is the radius of the asperity).…”

Section: The Definition Of a Rough Surfacementioning

confidence: 99%

Extension of dashpot model with elastoplastic deformation and rough surface in impact behavior

Wang

Faes

Cheng

et al. 2022

Chaos, Solitons & Fractals

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Section: The Definition Of a Rough Surfacementioning

confidence: 99%

Extension of dashpot model with elastoplastic deformation and rough surface in impact behavior

Wang

Faes

Cheng

et al. 2022

Chaos, Solitons & Fractals

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“…Lee et al [18] used the interatomic potential function of the embedded-atom method to model face-centered cubic structures and to analyze the mode-I fracture behavior under various magnitudes of T-stress. The fractal theory is adopted to interpolate the surface roughness and morphology influence between the Cu rigid plane and elasto-plastic rough substrate [19]. Furthermore, the mixed-mode fracture characteristics of single crystal Cu are revealed to induce the transition of fracture patterns as the incensement of fracture mode mixity [20].…”

Section: Introductionmentioning

confidence: 99%

Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

Lee

2020

Molecules

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This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (E) of a given example on atomic-level single-crystal copper (Cu). This work aims to overcome the estimated drawback of a molecular dynamic calculation applied to the mechanical response of macro in-plane-sized and atomic-level-thick metal-based surface coatings. The interactive energy of two Cu atoms within a face-centered metal lattice was described by a mechanical response of spring stiffness. Compared with the theoretical value, the parameters of the Morse potential dominated the predicted accuracy through the FEA-based ACM. Moreover, the analytic results indicated that the effective E of a single-crystal Cu was significantly sensitive to the given range of the interactive force field among atoms. The reliable elastic moduli of 86.8, 152.6, and 205.2 GPa along the Cu(100), Cu(110), and Cu(111) orientations of the Cu metal were separately acquired using the presented FEA-based ACM methodology.

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Normal Contact Analysis Between Two Self-affine Fractal Surfaces at the Nanoscale by Molecular Dynamics Simulations

Sun

2023

Tribol Lett

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Fractal contact behavior of single crystal copper substrate and rigid plane

Cited by 3 publications

References 23 publications

Extension of dashpot model with elastoplastic deformation and rough surface in impact behavior

Extension of dashpot model with elastoplastic deformation and rough surface in impact behavior

Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

Normal Contact Analysis Between Two Self-affine Fractal Surfaces at the Nanoscale by Molecular Dynamics Simulations

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