Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

“…These observations are in good agreement with previous studies of the ternary Sn-Ag-Cu system. [46][47][48]56,57] The interfaces identified by the SEM/EDS measurements between the Cu and IMC, and between IMC themselves at any stage of the annealing are linear because the interfacial processes take place in the solid state and the Cu 3 Sn grows out of the Cu 6 Sn 5 phase. [9,[15][16][17] The exception is the interface between initially liquid solder and a Cu 6 Sn 5 layer (scallop-like morphology) formed during the early stage of annealing.…”

“…The growth rate of the Sn/Cu IMCs follows a parabolic kinetic law as it is reported in the literature. [15,26,27,[44][45][46]48,52,54,56,57] The corresponding activation energies are reported in Table 3. The growth rate of the IMC layers follows the parabolic rate law (dX=dt ¼ k=X), the observed correlation was in the range from [31] Cu|Sn thin films 101.3 83.9 25-220 [64] Cu thin film|Sn 6 Cu|Sn-0.6Cu-0.05Ni -66.3 80-150 [47] 0.95 to 0.98 (R 2 linear least squares fitting).…”

Three-dimensional analysis of the growth of intermetallics phases between solid steel and molten aluminium

“…(11). There might be two major factors which are responsible for this difference: one is that the reaction takes place on a 2D interface, not on a 3D one; and the other one could be that the diffusion is anisotropic in 3D space probably due to the stress effects [16] or the heterogeneous nucleation of the IMPs at the interface which needs further theoretical modelling and analysis.…”

“…Among those investigations, the thickness of IMPs is measured via maximal/minimal thickness [3], or mean thickness calculated as the ratio between the total area and the total length of IMPs [10]; fractal analysis [11] and width of half height are also applied as well [12]. Due to the complicated pattern of IMPs, obviously the method on the treatment of the IMPs has to be standardized or generalized to minimize the uncertainty and enhance the comparability of the results between different researchers.…”

Effect of Ag addition on the corrosion properties of Sn‐based solder alloys

“…For the subtitution of Pb from the electronics industry, many types of solder alloy have been suggested as alternatives. Sn-based solder alloys with some alloying elements such as Cu, Ag, In, Bi, and Zn have been tried by several researchers [5][6][7][8][9][10]. Among them, eutectic Sn-Ag alloy for its good mechanical properties, high reliability, and lack of patent coverage has been most widely recommended [11].…”