2018
DOI: 10.1007/s10853-018-3128-0
|View full text |Cite
|
Sign up to set email alerts
|

Formulation of Al–Bi–Sn immiscible alloys versus the solidification behaviors and structures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(1 citation statement)
references
References 40 publications
0
1
0
Order By: Relevance
“…Immiscible alloy is characterized by the miscibility gap in the phase diagram, which generally experiences liquid-liquid phase separation (LLPS) in this zone [1], as shown in Figure 1. Many of them have a wide range of applications, such as superconducting, electrical contact, and self-lubricating materials [2][3][4][5][6][7]. In particular, immiscible alloy with a regular core-shell structure has huge application potential in electronic packaging solders [8,9].…”
Section: Introductionmentioning
confidence: 99%
“…Immiscible alloy is characterized by the miscibility gap in the phase diagram, which generally experiences liquid-liquid phase separation (LLPS) in this zone [1], as shown in Figure 1. Many of them have a wide range of applications, such as superconducting, electrical contact, and self-lubricating materials [2][3][4][5][6][7]. In particular, immiscible alloy with a regular core-shell structure has huge application potential in electronic packaging solders [8,9].…”
Section: Introductionmentioning
confidence: 99%