2015
DOI: 10.1016/j.solmat.2015.06.057
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Forming aluminum electrodes by screen printing and electron-beam evaporation for high performance interdigitated back contact solar cells

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Cited by 10 publications
(5 citation statements)
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References 26 publications
(20 reference statements)
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“…As the p-doped surfaces are lowly doped, the specific resistivity is higher though it stays under the crucial limit of 0.01 Ω cm 2 . As a low-cost approach, Chena et al [88] applied the aluminum electrodes deposited by e-beam evaporation using Al contact for high performance IBC cells. The specific contact resistivity of the Al contact cell resulted in 0.7 and 0.05 mΩ cm 2 on an n-doped and p-doped surface, respectively, and the final Al-contacted IBC cell resulted in an efficiency of 22.72%.…”
Section: Interdigitated Back Contact Solar Cellmentioning
confidence: 99%
“…As the p-doped surfaces are lowly doped, the specific resistivity is higher though it stays under the crucial limit of 0.01 Ω cm 2 . As a low-cost approach, Chena et al [88] applied the aluminum electrodes deposited by e-beam evaporation using Al contact for high performance IBC cells. The specific contact resistivity of the Al contact cell resulted in 0.7 and 0.05 mΩ cm 2 on an n-doped and p-doped surface, respectively, and the final Al-contacted IBC cell resulted in an efficiency of 22.72%.…”
Section: Interdigitated Back Contact Solar Cellmentioning
confidence: 99%
“…Hence, several types of materials, methodology and geometrical structure have been introduced to form the back surface in order to improve the cell efficiency by researchers over the years [20][21][22][23]. In recent years, another potential cheaper contact-forming technique, deposition by evaporation, has been attempted that can replace fired silver/aluminum paste screen printed deposition forming the required thickness of back surface contact within very short time having advantages of good ohmic contact [6][17] [24][25]. However, the impact of other materials as BSF with different metals having different work-functions by thermal evaporation method is yet to be studied thoroughly.…”
Section: Influence Of Different Metals Back Surface Field On Bsf Silimentioning
confidence: 99%
“…현 재까지 스크린 인쇄는 단독 구동방식의 평판 스크린 타입의 장비가 주를 이루며 [1][2][3][4][5][6][7][8] , 유연전자 제품에 적용하기 위한 롤투롤(roll-toroll) 형태의 스크린 인쇄 장비도 개발되어 활용되고 있다 [9][10][11] . 대…”
Section: 서 론unclassified