Formation of Zn Films by Magnetron Sputtering on Glass, Quartz and Silicon Substrates

Features of Electrostatic Fields and Their Force Action When Using Micro- and Nanosized Inter-Electrode Gaps

“…Thus, at small distances between the charged planes the discreteness of electric charge distribution should be taken into consideration. Indeed, in experiments [ 3 , 6 , 7 ] ponderomotive forces are often observed that have a much larger value than calculated according to Equation (1). One of the reasons for this is probably a discrete charge distribution.…”

“…However, it should be noted that can also be understood as macroscopic charges unevenly distributed over the plane. Such charges, for example, are deliberately created in the so-called matrix electrets and, therefore, the approach considered below can be used, for example, to calculate the electric fields of matrix electrets and to study the effect of spatially separated charges in various capacitive systems, structures with a macroscopically distributed charge in the form of ionized impurities, quantum dots, etc., [ 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ].…”

“…Electroadhesive seals (EAS)—metal-to-dielectric “gluing” formed because of the forceful action of the EF. The use of electroadhesive technologies, also known as anodic bonding, makes it possible to form a permanent connection of solid objects at temperatures significantly lower than in diffusion welding [ 3 ], and the presence of a vacuum is not necessary, and the installations used are much cheaper [ 4 , 5 , 6 , 7 ]. EAS can be successfully used to obtain permanent strong vacuum-tight connections of dielectrics (ceramics, glass, glass, quartz, etc.,) with metal conductors and semiconductor crystals in various combinations.…”

“…In [ 4 ] a theory of adhesion was proposed based on the general position of Helmholtz double electric layer (DEL) at the interface of the surfaces to be joined. Then, an electronic theory of adhesion was developed, in which the processes of the formation of DEL when joining the surfaces of dissimilar materials were studied and the contribution of DEL to the strength of the resulting “glues” was analyzed [ 4 , 5 , 6 , 7 ]. As a result, a new direction of research was born, associated with the possibilities of using electric fields to regulate adhesion.…”

“…The role of this factor in the phenomena of adhesion, in our opinion, is often underestimated. Indeed, as shown in [ 6 , 7 ], an increase in the electric charge density at the interface under the action of an external voltage makes it possible to obtain the pressure caused by electrostatic forces at the level used in diffusion welding (≈10 7 Pa), and to achieve not only temporary, but also permanent connection of parts. This method of joining is called electroadhesive, and the corresponding technology is called anodic fit or anodic bonding [ 5 ].…”