Abstract:Huge thermal noise owing to the narrow energy bandgap is one of the critical issues for group IV-based photonics in the mid-infrared regime. With this motivation, we examined to form Ge1−xSnx/Ge1−x−ySixSny quantum heterostructures (QHs) by molecular beam epitaxy for realizing resonant tunneling diodes composed of group-IV materials. We confirmed the formation of approximately 2 nm-thick Ge1−xSnx/Ge1−x−ySixSny QHs with atomically flat interfaces by x-ray diffraction and transmission electron microscopy methods.… Show more
“…26 However, the integration of SiGeSn/GeSn heterostructures in devices is still at an early stage. 27 While an increased optical emission is expected for SiGeSn/GeSn multi-quantum well (MQW) heterostructures, the band offset must be sufficiently large to be effective for room-temperature operation.…”
Si)GeSn semiconductors are finally coming of age after a long gestation period. The demonstration of devicequality epi-layers and quantum-engineered heterostructures has meant that tunable all-group IV Si-integrated infrared photonics is now a real possibility. Notwithstanding the recent exciting developments in (Si)GeSn materials and devices, this family of semiconductors is still facing serious limitations that need to be addressed to enable reliable and scalable applications. The main outstanding challenges include the difficulty to grow highcrystalline quality layers and heterostructures at the desired Sn content and lattice strain, preserve the material integrity during growth and throughout device processing steps, and control doping and defect density. Other challenges are related to the lack of optimized device designs and predictive theoretical models to evaluate and simulate the fundamental properties and performance of (Si)GeSn layers and heterostructures. This Perspective highlights key strategies to circumvent these hurdles and bring this material system to maturity to create farreaching new opportunities for Si-compatible infrared photodetectors, sensors, and emitters for applications in free-space communication, infrared harvesting, biological and chemical sensing, and thermal imaging.
“…26 However, the integration of SiGeSn/GeSn heterostructures in devices is still at an early stage. 27 While an increased optical emission is expected for SiGeSn/GeSn multi-quantum well (MQW) heterostructures, the band offset must be sufficiently large to be effective for room-temperature operation.…”
Si)GeSn semiconductors are finally coming of age after a long gestation period. The demonstration of devicequality epi-layers and quantum-engineered heterostructures has meant that tunable all-group IV Si-integrated infrared photonics is now a real possibility. Notwithstanding the recent exciting developments in (Si)GeSn materials and devices, this family of semiconductors is still facing serious limitations that need to be addressed to enable reliable and scalable applications. The main outstanding challenges include the difficulty to grow highcrystalline quality layers and heterostructures at the desired Sn content and lattice strain, preserve the material integrity during growth and throughout device processing steps, and control doping and defect density. Other challenges are related to the lack of optimized device designs and predictive theoretical models to evaluate and simulate the fundamental properties and performance of (Si)GeSn layers and heterostructures. This Perspective highlights key strategies to circumvent these hurdles and bring this material system to maturity to create farreaching new opportunities for Si-compatible infrared photodetectors, sensors, and emitters for applications in free-space communication, infrared harvesting, biological and chemical sensing, and thermal imaging.
“…1,[3][4][5][6] This means that a quantum confinement structure suitable for device applications such as light-emitting diodes, semiconductor lasers, and high electron mobility transistors can be realized using only strain-free group-IV semiconductors. Several groups, including us, recently demonstrated the crystal growth of type-I band structures, specifically, Ge 1−x−y Si x Sn y /Ge junction, 7) Ge 1−x−y Si x Sn y /Ge 1−x Sn x / Ge 1−x−y Si x Sn y double heterojunctions, [8][9][10][11] and the multiquantum well. [12][13][14] They showed Ge 1−x−y Si x Sn y 's high potential for use in the cladding layers of lasers and resonant tunneling diodes.…”
We investigate Sn incorporation effects on the thermoelectrical characteristics of n-type Ge-rich Ge1−x−y
Si
x
Sn
y
layers (x ≈ 0.05−0.1, y ≈ 0.03) pseudomorphically grown on semi-insulating GaAs(001) substrates by molecular beam epitaxy. Despite the low Sn content of 3%, the Sn atoms play a role in suppressing the thermal conductivity from 13.5 to 9.0 Wm−1K−1 without degradation of the electrical conductivity and the Seebeck coefficient. Furthermore, a relatively high power factor (maximum: 14 μWcm−1K−2 at room temperature) was also achieved for the Ge1−x−y
Si
x
Sn
y
layers, almost the same as the Si1−x
Ge
x
ones (maximum: 12 μWcm−1K−2 at room temperature) grown with the same conditions. This result opens up the possibility of developing Sn-incorporated group-IV thermoelectric devices.
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