Formation of subsurface Cu-O-Si system through laser-induced plasma-assisted copper penetration for fabricating robust adhesive copper wire on glass substrate

Wei, Kai; Lin, Chih-Kuang; Tung, Pi Cheng; Ho, Jeng Rong; Tsao, I-Yu

doi:10.1016/j.apsusc.2022.155149

Cited by 10 publications

(2 citation statements)

References 27 publications

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“…Region A, situated on the glass side and slightly further from the interface, exhibited a strong diffusion pattern in Fig. 7 ( previous study [30] on the formation mechanism of a new phase, it could be concluded that this region consisted of a Cu-O-Si composition. The formation of the layer between Cu nanoparticles and amorphous SiO2 was a significant contributing factor to the enhanced weld strength between Cu and SiO2.…”

Section: Elemental Analysis and Phase Identificationmentioning

confidence: 61%

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Nguyen,

Lin,

Tung

et al. 2023

Preprint

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In this study, we conducted an investigation into the heterogeneous bonding process of glass and copper using a nanosecond pulsed laser for laser transmission welding. Our research focused on examining various processing parameters and the influence of focal plane positions on bonding quality. To evaluate weld strength, we employed both pull-tensile separation force (PTSF) and shear-tensile separation force (STSF) measurements. The analysis of fracture and separation results encompassed detailed examinations of weld morphology, microstructure, elemental composition, and phase configuration. The results revealed that increasing the laser welding energy initially enhanced the weld strength until it reached a saturation point. This saturation point was attributed to the formation of voids or cracks, leading to residual stress within the weld zone due to non-uniform hot spots in the molten area during processing. Among the different focal plane positions tested, positioning it below the glass/copper interface yielded the highest weld strength. The maximum achieved bond strength was above 10 MPa, demonstrating the feasibility of cost-effective pulsed laser welding for copper-to-glass applications. Furthermore, the welds exhibited superior resistance to STSF compared to PTSF. PTSF caused breaking at the weld seam-glass boundary, leaving the weld seam on the copper plate, whereas STSF resulted in separation along the weld-copper interface, leaving the weld seam on the glass sheet. In-depth analysis through SEM and EDS elucidated that Cu and SiO2 underwent intra-mixing and inter-particle diffusion in the molten pool during welding. HR-TEM and SAED observations unveiled the presence of polycrystalline copper nanoparticles, copper oxides, and an amorphous Cu-O-Si region at the weld interface. This amorphous region significantly contributed to the robust bonding between copper and glass.

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Section: Elemental Analysis and Phase Identificationmentioning

confidence: 61%

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Nguyen,

Lin,

Tung

et al. 2023

Preprint

Self Cite

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“…However, further expansion of such works is faced with the same problem: the microheater and optical devices must be separated in space to avoid interference between the two devices in the processing. , The transparent electrode can partially overcome this problem, and the Ag or graphene wire network can be used as the lens surface defogger. , But the spraying method required to deposit such transparent electrodes poses challenges in avoiding contamination during the fabrication process. Meanwhile, the transparent electrode is easily fused at high temperatures or peeled off by friction, making it prone to failure in application. − Direct-writing technology intrinsically avoids contamination by selective patterning, while achieving robust adhesion between the deposited materials and the substrate surface remains challenging. The integration of laser direct writing and metal deposition presents a promising approach. , Laser direct writing enables three-dimensional patterning and roughens the substrate surface, which facilitates strong bonding.…”

Section: Introductionmentioning

confidence: 99%

Microheater-Integrated Microlens Array for Robust Rapid Fog Removal

Wu,

Jiang,

et al. 2023

ACS Appl. Mater. Interfaces

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In extreme environments, fog formation on a microlens array (MLA) surface results in a device failure. One reliable solution for fog removal is to heat the surface using a microheater. However, due to the surface interference, the combination of these two microdevices remains elusive. In this study, we introduce lift-off and electroless plating into femtosecond laser processing to fabricate a microheater integrated MLA (μH-MLA) on the same substrate with high light transmittance, durability, and fog removal efficiency. Laser-induced micro−nano grooves enable the microheater to be tightly coupled with the MLA and have high heating performance, thus maintaining a stable performance for over 24 h during continuous operation as well as under long time ultrasonic vibration and mechanical friction. With a rapid response time (τ 0.5 ) of 17 s and a high working temperature of 188 °C, the μH-MLA removed fog that covers the entire face within 14 s. Finally, we prove the use of this fabrication method in large areas and curved surface environments. This study provides a flexible, stable, and economical method to integrate micro-optical and microelectrical devices.

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Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Hu,

Lin,

et al. 2024

Small Methods

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Integration of wafer‐scale oxide and semiconductor materials meets the difficulties of residual stress and materials incompatibility. In this work, Ag NPs thin film is contributed as an energy confinement layer between oxide (Sapphire) and semiconductor (Si) wafers to localize the materials interaction during ultrafast laser irradiation. Due to the plasmonic effects generated within constructed dielectric–metal–dielectric structures (i.e., Sapphire–Ag–Si), thermal diffusion and chemical reaction between Ag and its neighboring materials facilitate the microwelding of Sapphire and Si wafers. Ag NPs can be totally sintered within the junction area to bridge oxide and semiconductor, while Al─O─Ag bond and Ag─Si bond are formed at Ag–Sapphire and Ag─Si interfaces, respectively. As‐received heterogeneous joint exhibits a high shear strength up to 5.4 MPa, with the fracture occurring inside Si wafer. Meanwhile, insertion of metal nanolayer can greatly relieve the residual stress‐induced microcracking inside the brittle materials. Such wafer‐scale Sapphire and Si interconnects thus show robust strength and excellent impermeability even after thermal shocking (−40 °C to 120 °C) for 200 cycles. This metal NPs layer‐assisted plasmonic microwelding technology can extend to broad materials integration, which is promising for high‐performance microdevices development in MEMS, MOEMS, or microfluidics.

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Formation of subsurface Cu-O-Si system through laser-induced plasma-assisted copper penetration for fabricating robust adhesive copper wire on glass substrate

Cited by 10 publications

References 27 publications

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Microheater-Integrated Microlens Array for Robust Rapid Fog Removal

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

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