2013
DOI: 10.1016/j.jpowsour.2012.07.091
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Formation of spinel reaction layers in manganese cobaltite – coated Crofer22 APU for solid oxide fuel cell interconnects

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Cited by 88 publications
(46 citation statements)
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“…The microstructure of this reduced coating has been investigated using FIB and electron microscopy as in our previous studies. 11,12 It is shown that the interfacial microstructure in this sample is somewhat different from that anticipated, with thin chromia and spinel layers forming even during the reduction step. The consequences of these observations for the mechanisms of microstructural development in MCO coatings are discussed.…”
Section: Introductionmentioning
confidence: 61%
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“…The microstructure of this reduced coating has been investigated using FIB and electron microscopy as in our previous studies. 11,12 It is shown that the interfacial microstructure in this sample is somewhat different from that anticipated, with thin chromia and spinel layers forming even during the reduction step. The consequences of these observations for the mechanisms of microstructural development in MCO coatings are discussed.…”
Section: Introductionmentioning
confidence: 61%
“…11,12 It was found that the uncoated Crofer formed a two-layer chromiazMnCr 2 O 4 scale, whereas the MCO coated Crofer exhibited a (Mn,Co,Cr,Fe) 3 O 4 spinel RL between the coating and the chromia subscale on the Crofer substrate surface. The development of the RL was studied by comparing data from coated samples oxidised for different times at 800uC in air.…”
Section: Introductionmentioning
confidence: 99%
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“…3 µm thick Cr 2 O 3 + (Mn,Cr) 3 O 4 scale forms at the coating/alloy interface[30]. After a re-oxidation heat treatment, a reaction layer comprising Mn, Cr, Co and Fe is detected between the oxide scale and the re-oxidized coating[51]. The oxide scale now consists of primarily Cr 2 O 3 .…”
mentioning
confidence: 99%
“…For the deposition of protective‐conducting coatings, many different methods have been developed. Starting from slurry deposition, electrophoretic deposition, to physical vapor deposition and electrodeposition . Different deposition methods result in different microstructures and often require an additional processing step for debinding or sintering.…”
Section: Introductionmentioning
confidence: 99%