Formation of RuO2 thin film using dopamine as a reducing, chelating, and adhesive agent simultaneously

Chou, Shih‐Chien; Lin, Chun Chieh; Sun, Bo; Tso, Kuang Chih; Chan, Ting Shan; Wu, Pu Wei

doi:10.1016/j.jtice.2021.02.016

Cited by 10 publications

(8 citation statements)

References 32 publications

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“…Changes in the oxidation state of materials in contact with redox active surfaces or solution species have also been described for the EL deposition of oxides of Ti, 148 V, 148,187 Mo, 145,148 W, 108,145,147 Mn, 149,150,188,189 Fe, 2,155,156,158,188 Ru, 110,162,163,188 Ir, 166 Cu, 90,167 Pb, 173 and mixed met- als. 88,143,157,169 For example, Moulai and co-workers 189 report the deposition of MnO 2 onto H-terminated Si nanowires via simple treatment of the Si nanowires with aqueous KMnO 4 solution.…”

Section: ■ Nonmetalsmentioning

confidence: 98%

“…Direct EL deposition of RuO 2 has also been reported. For example, the Wu group has demonstrated that dopamine directly reduces RuO 4 to stable RuO 2 colloids coated by polydopamine (PDA). In the presence of a glass substrate at 40 °C, a PDA layer coats the substrate as well, facilitating deposition of ∼47 nm thick RuO 2 films.…”

Section: Elementsmentioning

confidence: 99%

“…The stringent requirements of modern electronics for the development of EL processes for precise control of the placement, dimensions, and morphology of metal components present as integral parts of ICs have, in turn, spurred uses in unrelated fields. Today EL metal applications also include Microelectromechanical Systems (MEMs), − magnetic materials, ,− advanced heating elements, chemical sensors, biodegradable electronics, forensic fingerprint visualization, enhancement, and preservation, − anticounterfeiting materials, , superhydrophobic surfaces for controlled wettability, − materials for enhanced electromagnetic interference (EMI) shielding, − lightweight battery, transparent, − and catalyst functionalized electrodes, − reproducible substrates for Surface-Enhanced Raman Spectroscopy (SERS), − passive electronic components, − permeable membranes, , wastewater remediation, energy storage, − self-healing materials, , composites, ,, supported metal and alloy catalysts, ,− and advanced optical materials, including metamaterials. , …”

Section: Introductionmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: ■ Nonmetalsmentioning

confidence: 98%

Section: Elementsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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“…The excepted adhesion of polydopamine allows the nanomaterials to adhere closely to the substrate, ensuring the stability of the material 39 . At the same time, the reducibility of polydopamine due to its own structure also provided convenience for the production of manganese oxide 40,41 . SN@PDA@MnO X uses chemodynamic, only in the presence of water and oxygen without adding external stimuli, pathway to significantly generate the amount of ROS in a short period of time.…”

Section: Introductionmentioning

confidence: 99%

The chemodynamic antibacterial effect of MnO_X nanosheet decorated silicon nanowire arrays

Guize

Wang

et al. 2022

Mater. Adv.

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“…Polymer substrates are often chemically inert, and therefore, an intimate bonding with the metal deposit is an important step in the fabrication of a robust flexible electrode. Previously in our laboratory, we have employed polydopamine (PDA) as an adhesive agent to facilitate electroless Cu deposition on a SiO 2 substrate and the formation of dense RuO 2 thin film on a glass slide [ 11 , 12 ]. PDA is the polymeric form of dopamine, which is a natural molecule found in mussels [ 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Cu Micromembrane as a Flexible Electrode

et al. 2022

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A Cu micromembrane is successfully fabricated and validated as a porous flexible electrode. The Cu micromembrane is prepared by functionalizing individual polypropylene (PP) fibers in a polypropylene micromembrane (PPMM) using a mixture of polydopamine (PDA) and polyethyleneimine (PEI). The mixture of PDA and PEI provides adhesive, wetting, and reducing functionalities that facilitate subsequent Ag activation and Cu electroless plating. Scanning electron microscopy reveals conformal deposition of Cu on individual PP fibers. Porometer analysis indicates that the porous nature of PPMM is properly maintained. The Cu micromembrane demonstrates impressive electrical conductivities in both the X direction (1.04 ± 0.21 S/cm) and Z direction (2.99 ± 0.54 × 10−3 S/cm). In addition, its tensile strength and strain are better than those of pristine PPMM. The Cu micromembrane is flexible and mechanically robust enough to sustain 10,000 bending cycles with moderate deterioration. Thermogravimetric analysis shows a thermal stability of 400 °C and an effective Cu loading of 5.36 mg/cm2. Cyclic voltammetric measurements reveal that the Cu micromembrane has an electrochemical surface area of 277.8 cm2 in a 1 cm2 geometric area (a roughness factor of 227.81), a value that is 45 times greater than that of planar Cu foil.

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Formation of RuO2 thin film using dopamine as a reducing, chelating, and adhesive agent simultaneously

Cited by 10 publications

References 32 publications

Electroless Metallization of the Elements: Survey and Progress

Electroless Metallization of the Elements: Survey and Progress

The chemodynamic antibacterial effect of MnO_X nanosheet decorated silicon nanowire arrays

Fabrication of Cu Micromembrane as a Flexible Electrode

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Formation of RuO2 thin film using dopamine as a reducing, chelating, and adhesive agent simultaneously

Cited by 10 publications

References 32 publications

Electroless Metallization of the Elements: Survey and Progress

Electroless Metallization of the Elements: Survey and Progress

The chemodynamic antibacterial effect of MnOX nanosheet decorated silicon nanowire arrays

Fabrication of Cu Micromembrane as a Flexible Electrode

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Product

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The chemodynamic antibacterial effect of MnO_X nanosheet decorated silicon nanowire arrays