2018
DOI: 10.1088/1361-6528/aadfb6
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Formation of n- and p-type regions in individual Si/SiO2 core/shell nanowires by ion beam doping

Abstract: A method for cross-sectional doping of individual Si/SiO core/shell nanowires (NWs) is presented. P and B atoms are laterally implanted at different depths in the Si core. The healing of the implantation-related damage together with the electrical activation of the dopants takes place via solid phase epitaxy driven by millisecond-range flash lamp annealing. Electrical measurements through a bevel formed along the NW enabled us to demonstrate the concurrent formation of n- and p-type regions in individual Si/Si… Show more

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Cited by 6 publications
(9 citation statements)
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References 22 publications
(28 reference statements)
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“…10 Berenceń et al presented the phosphorus and boron doping of individual drop-cast Si/SiO 2 core/sell NWs using ion implantation. 19 In comparison to other doping methods, ion implantation demonstrates several advantages including high efficiency, high reproducibility, and precise control of the concentration and the depth profile of the dopants. In addition, ion implantation can provide a good homogeneity of the dopant depth distribution using one-or multiple-shot implantation depending on the desired depth profile.…”
Section: ■ Introductionmentioning
confidence: 99%
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“…10 Berenceń et al presented the phosphorus and boron doping of individual drop-cast Si/SiO 2 core/sell NWs using ion implantation. 19 In comparison to other doping methods, ion implantation demonstrates several advantages including high efficiency, high reproducibility, and precise control of the concentration and the depth profile of the dopants. In addition, ion implantation can provide a good homogeneity of the dopant depth distribution using one-or multiple-shot implantation depending on the desired depth profile.…”
Section: ■ Introductionmentioning
confidence: 99%
“…In addition, ion implantation can provide a good homogeneity of the dopant depth distribution using one-or multiple-shot implantation depending on the desired depth profile. 7,19,20 However, ion implantation is a destructive method which leads to the amorphization of the lattice structure. Therefore, an annealing process is needed to restore the lattice order and activate the dopant atoms.…”
Section: ■ Introductionmentioning
confidence: 99%
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“…In most cases, the processing of semiconductors requires the modification of their electronic properties via doping [9], [10]. To do so, ion implanters are routinely used as a way of implanting chemical dopants within them [11], [12]. However, ion beams can induce damage to the target material and even lead to its amorphization [13].…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the volatility of HF acid is extremely harmful. Ion-beam technology is used for surface modification or doping and even isolation, mainly in semiconductors. It has also been used to fabricate nanostructures. Compared with other methods, ion-beam technology is more reliable and reproducible to make porous Si. Therefore, we chose ion implantation to prepare nanoporous Si.…”
Section: Introductionmentioning
confidence: 99%