2003
DOI: 10.1016/s0169-4332(03)00152-1
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Formation of luminescent (NH4)2SiF6 phase from vapour etching-based porous silicon

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Cited by 70 publications
(39 citation statements)
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“…[228][229][230][231][232][233] In CVE a solution similarly to stain etching is made up from concentrated HF plus concentrated HNO 3 . However, instead of dipping the Si substrate in the solution, the substrate is held above the solution.…”
Section: Chemical Vapor Etchingmentioning
confidence: 99%
“…[228][229][230][231][232][233] In CVE a solution similarly to stain etching is made up from concentrated HF plus concentrated HNO 3 . However, instead of dipping the Si substrate in the solution, the substrate is held above the solution.…”
Section: Chemical Vapor Etchingmentioning
confidence: 99%
“…Porous silicon wafer was prepared with the vapor etching (VE) technique [28], using a bore-doped (100) oriented Si substrate (q = 2 X cm, N D = 5 9 10 15 cm -3 ) with mirror-polished surface. The VE method involves exposition of Si substrate to acid vapors issued from a mixture of HNO 3 and HF having a concentration of 65 and 40 %, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…2). The morphological features of PS and (NH 4 ) 2 SiF 6 depend on the Si doping type, the temperature of the acid mixture, the temperature of the Si substrate, and on-time exposure to the HNO 3 /HF vapors (Saadoun et al 2002;Ben Jaballah et al 2004;Saadoun et al 2003). Obviously the diverse PS morphologies essentially depend on the doping type (Fig.…”
Section: Equipment and Processingmentioning
confidence: 99%
“…The detailed experimental conditions of VE have been studied by Saadoun et al (Yablonovitch et al 1986) and Ben Jaballah et al (2004); this technique enables generating PS and/or a luminescent white powder (WP) corresponding to the (NH 4 ) 2 SiF 6 compound; later this surprising luminescence was attributed to embedded SiOx/Si nanoparticles (Saadoun et al 2003). One of these two phases can be dominant depending on the HNO 3 /HF volume ratio.…”
Section: Equipment and Processingmentioning
confidence: 99%
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