2003
DOI: 10.1016/s0022-0728(03)00053-6
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Formation of In2Se3 thin films and nanostructures using electrochemical atomic layer epitaxy

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Cited by 59 publications
(32 citation statements)
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“…The environment of the deposited atoms is different, and the resistance of the film increases with its thickness. This behavior has already been reported and discussed in many works [15,18,27,34]. Therefore, the control of the deposition process is complex.…”
Section: Electrochemical Behavior Of Sb On Ausupporting
confidence: 57%
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“…The environment of the deposited atoms is different, and the resistance of the film increases with its thickness. This behavior has already been reported and discussed in many works [15,18,27,34]. Therefore, the control of the deposition process is complex.…”
Section: Electrochemical Behavior Of Sb On Ausupporting
confidence: 57%
“…The crucial point in material electrodeposition is to control the dimensions, the stoichiometric ratio, and the crystallinity of the deposited structures. The electrochemical atomic layer epitaxy (EC-ALE) technique developed by Stickney [13] was proved to be a valid approach to control these parameters for the deposition of chalcogenide compounds on metallic substrates [14][15][16][17][18][19]. This method is based on the alternate underpotential deposition of atomic layers of the elements that form the compound, in a cycle that can be repeated as many times as desired.…”
Section: Introductionmentioning
confidence: 99%
“…167 Indium selenide fi lms were grown from indium sulphate and selenium oxide precursors. 168 The fi lms consisted of large particles, 70 to 200 nm in diameter. The band gap was 1.73 eV.…”
Section: Materials Grown By Ecalementioning
confidence: 99%
“…The band gap was 1.73 eV. 168 Oxidative underpotential deposition (UPD) of As from a HAsO 2 solution and reductive UPD of Ga from a Ga 2 (SO 4 ) 3 solution have been used to deposit GaAs on a gold substrate. 169,170 InAs fi lms grown by ECALE were stoichiometric, and the surface roughness did not increase from the substrate roughness during fi lm deposition.…”
Section: Materials Grown By Ecalementioning
confidence: 99%
“…The variety of materials includes but is not limited to: magnetic nanowires and superlattices for anisotropic magnetoresistance, AMR, giant magnetoresistance, GMR, and tunnelling magnetoresistance, TMR, memory applications [7,11,32,, polymer nanowires and nanotubes [68,69], semiconductor nanowires [70], rectifiers [37,71,72], single-crystal nanowires [36,[73][74][75][76][77][78][79][80][81][82][83][84][85], superconducting nanowires [86][87][88][89][90], and transistors [91]. Also, there is continued use of track-etched mica [92][93][94].…”
Section: Templatesmentioning
confidence: 99%