2006
DOI: 10.1149/1.2171814
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Formation of Cu-Sn Alloy Layer by Contact Deposition Using Quaternary Ammonium-Imide-Type Ionic Liquid

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Cited by 27 publications
(32 citation statements)
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“…Although ionic liquids are sometimes termed ''room-temperature molten salts,'' we should not adhere to the use of ionic liquids at room temperatures. We have recently been investigating the electrochemical alloying of a Cu-Sn layer at middle to low temperatures, 120-150°C, using TMHA-Tf 2 N as electrolyte [17]. At elevated temperatures, the advantages of ionic liquids, i.e.…”
Section: Diffusion Of Cu(i) Ions In Tmha-tf 2 N Ionic Liquidmentioning
confidence: 99%
See 1 more Smart Citation
“…Although ionic liquids are sometimes termed ''room-temperature molten salts,'' we should not adhere to the use of ionic liquids at room temperatures. We have recently been investigating the electrochemical alloying of a Cu-Sn layer at middle to low temperatures, 120-150°C, using TMHA-Tf 2 N as electrolyte [17]. At elevated temperatures, the advantages of ionic liquids, i.e.…”
Section: Diffusion Of Cu(i) Ions In Tmha-tf 2 N Ionic Liquidmentioning
confidence: 99%
“…In addition, ionic liquids can also be used as a solvent for electrodeposition processes at medium-low temperatures, i.e. 100-200°C, that cannot easily be attained with aqueous or volatile organic baths [17].…”
Section: Introductionmentioning
confidence: 99%
“…We thus focused on ionic liquids (ILs), which are currently the subject of considerable attention as a new ''green" electrolyte for electrochemical science and engineering [13][14][15]. Most ILs have a wider potential window (up to $5 V) and a higher thermal stability (up to 450°C) [16,17], so the use of ILs would maximize the performance of electrochemically active SAMs and contribute to their long-term stability when applied to some electronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…Especially, the treatment of the alloy deposition bath, the entropy of which is high since the bath contains two or more metal components, is energy-consuming in some cases. Recently, Murase and coworkers investigated the formation of Cu-Sn speculum alloy layers through a reduction-diffusion method using a galvanic contact [1] or potentiostatic alloying [2] of Cu substrate. Here, they demonstrated that the alloy layers can easily be prepared through successive electrochemical processes using two baths, each containing a single metal ions, i.e.…”
Section: Introductionmentioning
confidence: 99%