2015
DOI: 10.1016/j.tsf.2014.10.022
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Formation of alumina film using alloy catalyzers in catalytic chemical vapor deposition

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Cited by 5 publications
(5 citation statements)
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References 28 publications
(31 reference statements)
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“…Thus, the development of methods for the formation of dense corundum ceramics both in the form of coatings as well as bulk compacts is a relevant and challenging task of ceramic technology. The known methods of the formation of Al 2 O 3based coatings are sol-gel method [1], chemical vapor deposition [2,3], pulsed laser deposition [4,5], and electrophoretic deposition (EPD) [6][7][8]. The slip casting is known as one of the ceramic methods for producing corundum ceramics [9].…”
Section: Introductionmentioning
confidence: 99%
“…Thus, the development of methods for the formation of dense corundum ceramics both in the form of coatings as well as bulk compacts is a relevant and challenging task of ceramic technology. The known methods of the formation of Al 2 O 3based coatings are sol-gel method [1], chemical vapor deposition [2,3], pulsed laser deposition [4,5], and electrophoretic deposition (EPD) [6][7][8]. The slip casting is known as one of the ceramic methods for producing corundum ceramics [9].…”
Section: Introductionmentioning
confidence: 99%
“…Due to its unique properties such as high chemical inertness, refractory quality, high strength, and low electrical conductivity, alumina-based ceramics are used in a wide variety of high-technology areas of power engineering, mechanical engineering, electrotechnical industry, and instrumentation technology [1][2][3]. Alumina is used in the fabrication of thin-film coatings via pulsed laser deposition [4,5], chemical vapor deposition [6,7], and the sol-gel process [8]. Alumina powders are compacted using isostatic and magnetic pulse methods [9][10][11] and slip casting [12,13].…”
Section: Introductionmentioning
confidence: 99%
“…Trimethylaluminum (TMA) was also evaluated as a CVD precursor to form alumina films. In addition to an oxidizing agent, however, the process can require the use of a catalytic support (Ir, Ni‐Cr alloys) or plasma assistance, and otherwise employs deposition temperatures equal to, or higher than, those employed for ATI . These relatively high temperatures may limit the use of TMA‐ and ATI‐processed alumina films for the protection of materials for which the properties, e.g., mechanical, change significantly above 200–300 °C.…”
Section: Introductionmentioning
confidence: 99%