2021
DOI: 10.1016/j.ces.2020.116217
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Formation mechanism of amorphous silicon nanoparticles with additional counter-flow quenching gas by induction thermal plasma

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Cited by 17 publications
(15 citation statements)
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“…3b condensed and then surface atoms diffused to modify grain shapes and blur grain boundaries to form irregular shapes by the heat of plasma flame. Similar irregularly shaped nanoparticles were observed by condensation experiments of amorphous Si nanoparticles in high quenching gas (Zhang et al 2021). The high cooling rate may be a cause of the irregular shaped grains because the quenching rate of the grains at the upper wall of the chamber is higher than that at the lower wall.…”
Section: Condensation Processsupporting
confidence: 77%
“…3b condensed and then surface atoms diffused to modify grain shapes and blur grain boundaries to form irregular shapes by the heat of plasma flame. Similar irregularly shaped nanoparticles were observed by condensation experiments of amorphous Si nanoparticles in high quenching gas (Zhang et al 2021). The high cooling rate may be a cause of the irregular shaped grains because the quenching rate of the grains at the upper wall of the chamber is higher than that at the lower wall.…”
Section: Condensation Processsupporting
confidence: 77%
“…In contrast, if the CH 4 injection position is characterized with a relatively low temperature, less amount of SiC are formed because the concentration of released C atoms is limited and most SiNPs already be solidi ed simultaneously. e high injection position in current research is nearest to the plasma torch and temperature is also higher than other two cases, which already be demonstrated with the numerical results in a paper before (Zhang et al, 2021a).…”
Section: Formation Mechanisms Of Sinps and Carbon Coatingsupporting
confidence: 76%
“…In plasma torch, the injected Si precursors are evaporated instantaneously because of the extremely high temperature. en silicon vapors are transported to reaction chamber with a steep temperature gradient, and the quenching rate for silicon vapors will be higher than 10 5 K/s (Zhang et al, 2021a). Subsequently, the saturation vapor pressure of silicon decreases rapidly.…”
Section: Formation Mechanisms Of Sinps and Carbon Coatingmentioning
confidence: 99%
“…Even pure silicon nanoparticles are anticipated as promising materials for use in numerous applications such as lithography [ 2 ], electronic devices [ 3 ], electron transistors [ 4 , 5 ], floating gate memory devices [ 6 , 7 , 8 , 9 ], luminescent thermometers [ 10 ], and lithium ion battery electrodes [ 11 , 12 , 13 ]. Several Japanese groups have recently used thermal plasmas to achieve high-throughput production of silicon nanoparticles for lithium ion battery electrodes [ 14 , 15 , 16 , 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%
“…Strong cross-correlations between the temperature at an upstream plasma fringe and nanoparticle concentration in a downstream region have been found for a transferred arc plasma system [ 26 , 27 ] and for a non-transferred arc plasma jet in two-dimensional [ 28 ] and three-dimensional fields [ 29 ] in recent numerical studies using a method suitable for simulating dynamic behaviors of thermal plasma–nonionized gas coexisting flows [ 30 ]. Actually, to control temperature and flow fields and to control nanoparticle growth processes in ICTP systems, several experimental studies adopted quenching strategies using a water-cooled coil [ 31 ], a water-cooled ball [ 15 , 32 ], direct plasma control by pulse modulation [ 33 ], counterflow injection [ 18 , 34 ], and radial gas injection [ 35 , 36 ]. Effects of those quenching methods were also investigated using two-dimensional simulations for practical conditions [ 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 ].…”
Section: Introductionmentioning
confidence: 99%