The phase stability and thermoelectric properties of the layered structure of (Zn x Cu 2Àx )V 2 O 7 solid solutions were studied for x ! 0:2. Xray diffraction measurements, compositional studies, and thermal analysis verified that the low-temperature form of the (Zn x Cu 2Àx )V 2 O 7 solid solution (monoclinic structure, C2/c) was stable for 0:2 x 2 when heated below 863 K in air. On heating, phase transformation occurred at least at 0:2 x 2 at a nearly constant temperature of approximately 873 K; above this temperature, a high-temperature form of the (Zn x Cu 2Àx )V 2 O 7 solid solution was formed.The Seebeck coefficients of the low-temperature (Zn x Cu 2Àx )V 2 O 7 solid solution exhibited large negative values in the range of approximately À520 to À700 mV/K, and the electrical resistivity increased with Zn addition. The maximum power factor of 1:99 Â 10 À7 W/ m K 2 was obtained at 823 K for the low-temperature form of the (Zn 0:2 Cu 1:8 )V 2 O 7 solid solution.