Fork-shaped highly conductive pathways for maximum cooling in a heat generating piece

An experimental and computational investigation of thermal air flows through perforated pin heat sinks

“…Recent studies have demonstrated the potential of using highly conductive inserts to provide efficient pathways for heat removal from electronic components, Hajmohammadi et al [10] and the role of optimal plate thicknesses in laminar forced convection cooling of heat sources, Hajmohammadi et al [11]. Of greater relevance to the present study are those that have focused on the optimization of plate fin heat sinks using computational and experimental methods.…”

A numerical investigation of thermal airflows over strip fin heat sinks

“…These challenges have stimulated a number of cooling innovations, including the use of highly conductive inserts to provide more efficient pathways to heat removal, [2], and a number of promising liquid cooling methods. The latter include on-chip cooling, direct liquid jet impingement and dielectric liquid immersion which removes heat by convection currents, [3].…”

Characteristics of entropy generation and heat transfer in double-layered micro heat sinks with complex structure

“…It is important to keep the peak temperature lower than the acceptable temperature levels [1][2][3]. The uniformity of temperature distribution is also helpful for the reliability and lifetime of microelectronic equipment.…”