Forced Convection Cooling Across Rectangular Blocks

Davalath, Janardhan; Bayazıtoğlu, Yıldız

doi:10.1115/1.3248083

Cited by 197 publications

(56 citation statements)

References 5 publications

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“…The conjugate solution of uniformly heat generating components on air-cooled electronic boards, in two-dimensional flow configurations, is reported in [11][12][13] using the Simpler algorithm [14]. All of these flows were assumed to be time independent, which limits their applicability to only steady flows.…”

Section: Motivationmentioning

confidence: 99%

“…Therefore, an exponential-like curve represents the convective performance for each board. In the upstream region, special correlations account for entrance effects [12], whereas in the fully-developed region, the value of the heat transfer coefficient remains approximately uniform. However, if the components are not geometrically similar, as often is the case, different correlations are used for each component.…”

Section: Stage Threementioning

confidence: 99%

“…The correlation selected is from Davalath and Bayazitoglu [12], and differs from the current geometrical situation in the number and geometric dimensions of the packages. Nevertheless, the correlation is implemented yielding an exponential decrease in heat transfer coefficient values from the first to the third row (Fig.…”

Section: Stage Threementioning

confidence: 99%

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Concurrent thermal designs of PCBs: balancing accuracy with time constraints

1993

Microelectronics Reliability

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A thermal design methodology suitable for concurrent design of cost-driven electronic systems is proposed and exemplified for a sample printed circuit board (PCB). The design methodology utilizes an evolutionary concept, in which the analysis tools art capable of adjusting their level of complexity as the design evolves, initiating with rough approximate analyses and culminating with a conjugate conduction/convection simulation for a portion of the sample of the PCB. The level of approximation included at each stage is selected with consideration of both time and accuracy constraints. The importance of considering the conjugate problem in generating heat transfer coefficients for electronic packages is discussed. The proposed thermal design methodology is then applied to the Vu-Man artifact and the results are described to illustrate the effect that upstream thermal information can have on the evolution of a design.

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Section: Motivationmentioning

confidence: 99%

Section: Stage Threementioning

confidence: 99%

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Concurrent thermal designs of PCBs: balancing accuracy with time constraints

1993

Microelectronics Reliability

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“…They found that increasing the spacing between the blocks produces a better cooling of blocks. Davalath and Bayazitoglu (1987) studied the laminar forced convection over an array of heat generating rectangular blocks. They showed that the vertical faces of the heat generating blocks are not efficiently cooled.…”

Section: Introductionmentioning

confidence: 99%

Entropy Generation and Optimization of Laminar Forced Convection Air Cooling in a Horizontal Channel Containing Heated Sources

Bensouici

2017

JAFM

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A forced convection air-cooling of two identical heat sources mounted in a horizontal channel is numerically studied. Four effects of Reynolds number, separation distance, height and width of the components on the flow structure and heat transfer inside the channel have been examined. The entropy generation minimization method (EGM) is employed to optimize the heat transfer and fluid flow in the channel. The flow field is governed by the Navier-Stokes equation and the thermal field by the energy equation. The finite volume method and the SIMPLER algorithm are used to solve the continuity, momentum, energy and entropy generation equations. Results show that the mean Nusselt number increases with increase of the following parameters: Reynolds number, separation distance, height and width of the components. However, these parameters increase the total entropy generation, and thus provokes the degradation of the fan energy. The optimal values of separation distance, height and width heat source are: [(Sopt= 1 with W=0.25, C=0.25, Re=50, η=1.134), (Copt=0.3 with W=0.25, S=0.25, Re=100, η=0.895) and (Wopt= 0.1 S=0.25, C=0.25, Re=200, η=1.004)], respectively, where η is the optimization factor (=Num/S T * ) and is defined as the ratio of Nusselt number to the total entropy generation. Finally, the optimal and the best configuration for maximum heat transfer and minimum entropy generation is observed at Re=50, S=1, C=0.25 and W=0.25.

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“…Open cavity flow is also found in electronic block arrays. In this context, Davalath and Bayazitoglu [19] made a work by considering the each block under constant heat flux boundary conditions. Then, some of the studies are focused on to enhance heat transfer in blocked channels.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Combined Convection in an Open Cavity under Constant Heat Flux Boundary Conditions and Magnetic Field Using Finite Element Method

et al. 2014

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This study investigated the effects of the aspect ratio of the cavity for average fluid temperature at exit port, average Nusselt number, maximum temperature of the fluid in the domain, drag coefficient, isotherms and streamlines on behalf of different Hartmann numbers and Rayleigh numbers. Solution of governing equations of momentum and energy has been made by finite element technique. Above mentioned parameters such as an aspect ratio which is cavity height to cavity length change from Ar = 0.5 to 2 for different Rayleigh numbers and Hartmann numbers which change from Ra = 10 3 to 10 5 and Ha = 0 to 50 respectively. Prandtl number Pr = 7 and Reynolds number Re = 100 is fixed in this simulation. It is found that variation of the aspect ratio makes an important effect for higher values of Rayleigh numbers. Heat transfer enhances with increasing of aspect ratio. Increasing of Hartmann number decreases the heat transfer inside the cavity.

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Forced Convection Cooling Across Rectangular Blocks

Cited by 197 publications

References 5 publications

Concurrent thermal designs of PCBs: balancing accuracy with time constraints

Concurrent thermal designs of PCBs: balancing accuracy with time constraints

Entropy Generation and Optimization of Laminar Forced Convection Air Cooling in a Horizontal Channel Containing Heated Sources

Analysis of Combined Convection in an Open Cavity under Constant Heat Flux Boundary Conditions and Magnetic Field Using Finite Element Method

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