Force modeling of silicon monocrystal wire saw machining

Li, Shujuan; Wang, Jiabin; Tang, Aofei; Landers, Robert G.

doi:10.1109/isfa.2016.7790148

Cited by 9 publications

(11 citation statements)

References 12 publications

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“…where 2θ is the abrasive tip angle [19], θ = 65°, a p is the abrasive depth of penetration, μ s is the coefficient of friction between the abrasive and part, and H a is the part hardness. The number of abrasives in contact with the part is [20]…”

Section: Cutting Force Modelingmentioning

confidence: 99%

Dynamic Force Modeling of Wire Saw Machining Processes

Lie¹,

Wang³

et al. 2023

Preprint

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Wire saw machining is extensively used to cut hard and brittle materials because of the resulting narrow kerf size, low cutting forces, and minimal material waste. The change of cutting forces strongly affects the part surface quality. Current models compute static machining forces based on the process variables and cutting conditions. This paper builds a dynamic machining force model that includes the effect of the wire tension and describes how the force changes as the wire engages with the part and as the wire changes direction due to reciprocation. Machining of silicon monocrystal parts is used to experimentally validate the proposed dynamic force model. The results show a very good correlation between the simulated and experimental data. The model captures the transient effect of the machining forces as the wire becomes fully engaged with the part and it is able to capture the fluctuations in the normal force, which is due to the changes in wire tension, as the wire reciprocates.

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Section: Cutting Force Modelingmentioning

confidence: 99%

Dynamic Force Modeling of Wire Saw Machining Processes

Lie¹,

Wang³

et al. 2023

Preprint

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“…The slicing of monocrystalline silicon is the primary process of processing [ 5 ], accounting for about 30% of the total cost of the entire process [ 6 , 7 ]. Diamond-wire-saw cutting is widely used in the cutting process of hard and brittle materials [ 8 , 9 , 10 ] due to its advantages such as minimal material waste, low cutting force, and narrow saw gaps [ 11 , 12 , 13 ]. During the wire-saw machining process, process parameters such as part feed rate and wire velocity have an impact on the cutting process [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Liang

Lan

et al. 2023

Materials

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Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting is the most widely used method for slicing hard and brittle materials. The diamond abrasive particles on the wire saw wear to a certain extent, which affects the cutting force and wafer surface quality in the cutting process. In this experiment, keeping all the given parameters unchanged, a square silicon ingot is cut repeatedly with a consolidated diamond abrasive wire saw until the wire saw breaks. The experimental results show that the cutting force decreases with the increase in cutting times in the stable grinding stage. The wear of abrasive particles starts at the edges and corners, and the macro failure mode of the wire saw is fatigue fracture. The fluctuation of the wafer surface profile gradually decreases. The surface roughness of wafer is steady during the wear steady stage, and the large damage pits on the wafer surface are reduced in the whole process of cutting.

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“…Li et al 24 showed that the cutting forces strongly effect wafer quality. Furthermore, Li et al 25 used optic glass as test material and conducted an experiment to regulate the normal force by adjusting wire velocity. This study showed that the normal force control using wire velocity is possible.…”

Section: Introductionmentioning

confidence: 99%

“…This study showed that the normal force control using wire velocity is possible. Our previous research 24,25 was concerned with adjusting part feed rate to regulate the machining force and 18 was concerned with wafers that rotated during the operation and, thus, did not experience the large force fluctuations seen when machining square parts. To our knowledge no other research has considered the regulation of forces in wire saw machining.…”

Section: Introductionmentioning

confidence: 99%

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Wang,

Li,

Liang

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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Single crystal silicon wafers are often used as substrate material for integrated circuits. Often the wafer is cut by a wire with fixed abrasive diamond owning to a narrow kerf and a low cutting force. The cutting force changes during the process as the direction of wire movement continuously reverses (i.e., reciprocates), which may cause the wire saw to break, the wafer to collapse, and the wafer surface roughness to decrease even if the wire saw tension and the contact length between the wire and the wafer are fixed. In this work, a cutting force model including both normal and tangential forces was established to determine the relationship between the normal and tangential forces and the commanded wire speed. Separate controllers were developed to regulate both the normal force and the tangential force by adjusting the wire velocity. Experimental studies were conducted for wire saw processing of single crystal silicon wafers. Compared with a process using constant wire velocity, regulating the normal force can significantly reduce the processing time and the wafer surface roughness. The average improvements in processing time and wafer surface roughness are approximately 11% and 56%, respectively, when using normal force control, and approximately 29% and 30%, respectively, when using tangential force control. The results show that the normal and tangential forces can be well regulated during the machining process. In addition, the wafer surface roughness and machining time were lower in both experiments where the forces were regulated than in the experiment where a constant wire velocity was used. This paper demonstrates that the novel concept of regulating process forces in wire saw machining by adjusting the wire velocity can be used to optimize the cutting process of single crystal silicon, making the process more productive while decreasing the part roughness.

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Force modeling of silicon monocrystal wire saw machining

Cited by 9 publications

References 12 publications

Dynamic Force Modeling of Wire Saw Machining Processes

Dynamic Force Modeling of Wire Saw Machining Processes

Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

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