Focused Ion Beam as a Scanning Probe: Methods and Applications

Raffa, Vittoria; Castrataro, Piero; Menciassi, Arianna; Dario, P.

doi:10.1007/3-540-27453-7_11

Cited by 10 publications

(14 citation statements)

References 75 publications

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“…The Focused Ion Beam (FIB) is a valuable tool in the semiconductor industry since it enables imaging and modification of structures on the nanometer size scale [1]. The most important property of a FIB, the spotsize versus current curve, is largely determined by the transverse reduced brightness (hereafter abbreviated as the brightness) and longitudinal energy spread of its ion source.…”

Section: Introductionmentioning

confidence: 99%

Performance predictions for a laser-intensified thermal beam for use in high-resolution focused-ion-beam instruments

et al. 2014

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Photo-ionization of a laser-cooled and compressed atomic beam from a high-flux thermal source can be used to create a high-brightness ion beam for use in Focus Ion Beam (FIB) instruments. Here we show using calculations and Doppler cooling simulations that an atomic rubidium beam with a brightness of 2.1 × 10 7 A/(m 2 sr eV) at a current of 1 nA can be created using a compact 5 cm long 2D magneto-optical compressor which is more than an order of magnitude better than the current state of the art Liquid Metal Ion Source.

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Section: Introductionmentioning

confidence: 99%

Performance predictions for a laser-intensified thermal beam for use in high-resolution focused-ion-beam instruments

et al. 2014

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“…In normal operating conditions, the stainless-steel chamber is maintained in the range of 10 −7 mbar. For all tests reported in this work, the tilt angle 1 was fixed at − 0.4 • and the distance between the beam and the sample was selected by focusing in the eucentric point 2 (Raffa et al, 2006). Figure 2 illustrates an example of circular opening (diameter 5 µm) performed via FIB milling in a W wire coated with a 500 nm thick SiO 2 layer.…”

Section: Electrode Opening Via Fib Millingmentioning

confidence: 99%

“…FIB systems (Raffa et al, 2006) enable imaging, localized milling (Tseng, 2004), and deposition of conductors and insulators (Reyntjens and Puers, 2000) with high precision. FIB milling is a direct write micromachining technique, able of sub-100 nm resolution.…”

Section: Electrode Opening Via Fib Millingmentioning

confidence: 99%

Design criteria of neuron/electrode interface. The focused ion beam technology as an analytical method to investigate the effect of electrode surface morphology on neurocompatibility

Raffa

Menciassi

Dario

2007

Biomed Microdevices

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"Neurocompatibility" is a broad definition which comprises aspects of biocompatibility, chemical and physical surface properties, and biostability of an artificial substrate interfaced with a neural tissue. The main issue coming from the analysis of the state of art of neuroprosthesis and neuron/electrode interfaces is the strong influence of electrode surface morphology on neurocompatibility. Enhanced functions of neurons have been observed on nano-structured materials. This paper proposes the use of focused ion beam (FIB) technology as high precision machining technique to modify the surface morphology of an interface material. By controlling the ion milling in three dimensions, the fabrication of a surface with any predefined morphology becomes possible with nanometric precision. In vitro tests on PC12 cells cultured on surfaces with different morphologies show that the surface morphology influences the cell adhesion. Experimental results suggest an enhancement of the interaction between cells and artificial surfaces at a specific scale (tens of nanometres) which is the typical scale of cellular interaction in the extra-cellular matrix (ECM) of living organisms.

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“…The removal of sample material is achieved using a high ion current beam. By scanning the beam over the substrate, an arbitrary shape can be etched, whereby physical sputtering of the sample material occurs [5]. The milling process speed can be increased by using an etching gas Xenon difluoride (XeF 2 ) into the work chamber during milling.…”

Section: Fib Imaging Milling and Depositionmentioning

confidence: 99%

“…The main difference is better resolution, but lower deposition rate of FIB. The deposited material is not fully pure because organic contaminations and Ga + ions are inevitably included [5]. The smallest features that can be deposited are of the order of 100 nm (lateral dimension).…”

Section: Fib Imaging Milling and Depositionmentioning

confidence: 99%

Application of Focused Ion Beam Micromachining: A Review

Atiqah

Jaafar

Ali

et al. 2012

AMR

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Abstract. Fabrication of micro and nanoscale components are in high demand for various applications in diversified fields that include automotive, electronics, communication and medicine. Focused ion beam (FIB) machining is one of the techniques for microfabrication of micro devices. This paper presents a review of FIB machining technology that include its parameter, responses, its important component systems, as well as the fundamentals of imaging, milling (etching) and deposition techniques. The application of FIB in micromachining is also presented.

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Focused Ion Beam as a Scanning Probe: Methods and Applications

Cited by 10 publications

References 75 publications

Performance predictions for a laser-intensified thermal beam for use in high-resolution focused-ion-beam instruments

Performance predictions for a laser-intensified thermal beam for use in high-resolution focused-ion-beam instruments

Design criteria of neuron/electrode interface. The focused ion beam technology as an analytical method to investigate the effect of electrode surface morphology on neurocompatibility

Application of Focused Ion Beam Micromachining: A Review

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