Abstract:Solder bumps on flip chips could arrive at the manufacturing floor with prior damage. While bumps with insufficient solder volume may not solder well even if adequately fluxed, the bumps that are flattened during damage are also of concern for fluxing. Good assembly yields will depend on whether these bumps are fluxed adequately and whether the collapse offered by the substrate design is sufficient to bring the damaged bumps in contact with their target pads. The former depends on the flux application method a… Show more
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