Flux-Driven Lateral Grain Growth during Reactive Diffusion

Intermetallics Disappearance Rates and Intrinsic Diffusivities Ratios Analysis in the Cu-Zn and the Cu-Sn Systems

“…Two phases are formed in the Cu-Sn system during isothermal annealing of Cu/Sn samples at temperature T = 200 o C [3,6,9]: ε-phase Cu3Sn (phase 1, C1 ≈ ¾ = 0.753, ∆C1 = 0.012, C = CCu [6]) and η-phase Cu6Sn5 (phase 2, C2 ≈ 6/11 = 0.547, ∆C2 = 0.021, C = CCu [6]), at temperature T = 210 o C [10], and at temperature T = 250 o C (Sn is liquid) [11]. Parabolic growth constants for the layer thicknesses were measured in [6], also the range of homogeneity of each phase were measured, and the values of the mutual diffusion coefficients for the Cu3Sn (phase 1) and Cu6Sn5 (phase 2) phases between 463 K and 493 K (190 o C and 220 o C) were calculated too: [12] or by "constant flux method" (Gurov's and Gusak's method) [13][14][15][16][17][18][19][20][21][22][23] or by other methods [26,[28][29][30] (data are from [6] as an example):…”