2015
DOI: 10.1109/tsm.2015.2427876
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Fluorocarbon Chemistry: A 0-Dimensional Model for Oxide and Nitride Dry Etching

Abstract: In this work, a 0-dimensional model for the understanding of dry etching characteristics in silicon oxide and nitride materials is reported. The model is applied to analyze the etching performances in a design of experiments where gas mixtures are varied in the fluorocarbon chemistry typical of the "protected sidewall" regime. The modeling analysis of flat sample etching allows for an accurate tuning of the selectivity's behavior, and can be generalized to deal with patterned samples. In particular, we apply a… Show more

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Cited by 3 publications
(1 citation statement)
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“…Recently C 4 F 8 /O 2 was used for contact hole etching, [14] nitride etching [15], and atomic layer etching [16]. This has led to increasing studies of the electrical and chemical properties of C 4 F 8 plasma as well as its mixtures.…”
Section: Introductionmentioning
confidence: 99%
“…Recently C 4 F 8 /O 2 was used for contact hole etching, [14] nitride etching [15], and atomic layer etching [16]. This has led to increasing studies of the electrical and chemical properties of C 4 F 8 plasma as well as its mixtures.…”
Section: Introductionmentioning
confidence: 99%