Fluorinated Phthalonitrile Resin with Excellent Thermal Stability and Low Dielectric Constant for High‐Frequency Electronic Packaging

Abstract

Phthalonitrile (PN) resin promising material for preparing high‐speed and high‐frequency electronic packaging because of its unique hightemperature resistance and excellent insulation performance. A fluorinated PN oligomer (4,4’‐bis (p‐perfluoro‐phenol‐(bis(p‐phenol)perflouoropropane‐2,2‐diyl)‐p‐oxy‐diphthalonitrile) (PFDP)) containing trifluoromethyl and decafluorobiphenyl groups are designed, synthesized, and characterized. The oligomer is blended with 4‐(aminophenoxy) phthalonitrile (APPH), and then cured into polymers under the temperature‐programmed process. The reactive blend has good processability, and structures of isoindole, triazine ring, and phthalocyanine ring are found in the curing reactions. The fluorinated PN (P‐380) shows outstanding thermal stability and mechanical properties (5% thermal degradation temperature: 518 °C (N2); 516 (Air), THeat‐resistance index: 268 °C, activation energy of thermal decomposition: 334.89 kJ mol−1, glass transition temperature (Tg) > 400 °C). Meanwhile, the fluorinated PN simultaneously exhibited a superior low dielectric constant (Dk, 2.21) and dielectric loss (Df, 0.01) at 10 GHz. Moreover, the water absorption of the resin is as low as 0.74%, which meets the requirement of dielectric materials. These results would strongly suggest such PFDP PN resin as excellent packaging materials in those high‐tech applications such as aerospace and communication electronic devices.

Poly(silylene arylacetylene)s containing hexafluoroisopropylidene with attractive mechanical properties and dielectric performance for wave-transparent composites

“…47 Besides, the heat-resistant index ( T HRI ) value of the three cured resins was calculated as 262 °C, 264 °C, and 259 °C, respectively according to eqn (2). 48 T HRI = 0.49 × [ T d5 + 0.6 × ( T d30 − T d5 )]where T d5 and T d30 are the corresponding decomposition temperature of 5% and 30% weight loss, respectively. The T HRI values of the three cured resins are prominently superior to those of heat-resistant resins, such as cyanate ester resin and benzoxazine resin.…”

“…47 Besides, the heat-resistant index (T HRI ) value of the three cured resins was calculated as 262 1C, 264 1C, and 259 1C, respectively according to eqn (2). 48 T HRI = 0.49…”

Covalent Grafting of PMMA Organic Film on Porous Silicon for Achieving Ultralow-k Organic Films

“…Therefore, both of these reasons can lead to a low value of k . The good dielectric properties mean that this material may have potential applications in the field of high-frequency communications in the electronics industry. , …”

Preparation of phthalonitrile resins containing siloxane linkages with improved processability

“…In the past 40 years, phthalonitrile resins have been widely studied due to their high glass transition temperature (T g ), excellent thermal and thermo-oxidative stability, excellent mechanical properties, good moisture resistance, and excellent fire resistance. [1][2][3][4][5][6][7][8] Concurrently, to expand the application prospects of phthalonitrile resin in the marine, aerospace, and microelectronics industries, new types containing imide, 9 bismaleimide, 10 benzoxazine, 11 novoazole, 12 alkyl, 13 amino, 14 and other functional phthalonitrile monomers have been designed and successfully prepared. However, phthalonitrile resin usually contains biphenyl, 15,16 naphthyl, 17,18 pyridyl, 19,20 and other rigid groups.…”