Polyimide nanocomposites having low-k and UV shielding properties have been developed using fluorine functionalized graphene oxide and bis(quinoline amine) based polyimide. The polyimide was synthesized using bis(quinoline amine) and pyromellitic dianhydride at appropriate experimental conditions, and its molecular structure was confirmed through various spectral analysis such as FTIR and NMR.The polyimide (PI) composites were prepared using bis(quinoline amine), pyromellitic dianhydride, and separately filled with 1, 5, 10 wt% of fluorinated graphene oxide (FGO) through in situ polymerization. The polymer composites were characterized using thermo gravimetric analysis (TGA), X-ray powder diffraction (XRD), and scanning electron microscopy (SEM). In addition, the water contact angle, dielectric behavior, and UV-Vis shielding behavior of FGO/PI composites were evaluated. The value of the water contact angle of the polyimide was increased with increment of FGO in the polyimide matrix. The highest water contact angle of polyimide composites observed 108 was obtained for 15 wt% FGO reinforced polyimide composite.The value of the dielectric constant for neat, 1, 5, and 15 wt% FGO reinforced polyimide composites was obtained as 4.5, 3.7, 2.6, and 2.0, respectively. It is also observed from by UV-Vis spectroscopy analysis that the FGO reinforced polyimide composites have good UV shielding behavior.bis(quinoline amine), fluorine functionalized graphene oxide, hydrophobic behavior, low dielectric constant, polyimide matrix and composites, thermal stability, UV shielding behavior
| INTRODUCTIONPolymeric composites used in high performance applications have exceptional optical, chemical, thermal, dielectric constant, UV shielding behavior, and physical properties. [1][2][3][4][5] Low conductivity materials are widely used in computers, telecommunications, automotive, printed circuit boards, and consumer electronics systems and are mainly equipped with integrated circuit device to reduce resistancecapacitance time delay, power dissipation, and cross talk. [6][7][8][9][10][11][12] The next generation of consumers can expect demand in miniature electronic products with low cost, high efficiency, and improved functionality. 13 Polyimides (PIs) has been used in various advanced industrial applications such as optoelectronics, aerospace engineering, adhesives, non-linear optical devices, interconnections, and packaging applications due to its high-performance properties, excellent mechanical properties, high thermal stability, low dielectric values (low k value), and good UV radiation-resistant properties. [14][15][16][17] Heterocyclic core contain polyimides and nanocomposites provide high-temperature resistant