Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate

Zhang, Lanying; Zhang, Yang-Fei; Chen, Jiaqi; Bai, Shu‐Lin

doi:10.1016/j.ijheatmasstransfer.2014.12.079

Cited by 46 publications

(12 citation statements)

References 36 publications

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“…The electronic systems have demanded electronic functional components in terms of size, weight, reliability and safety, and the more efficient microelectronic packaging [4]. Low temperature co-fired glass-ceramics technology has been referred to as a key technology for advanced packaging with widely successful applications owing to simply achieving highly reliable and miniature modules [5][6][7][8]. However, the mechanical and electrical properties of thick film conducting system may be affected due to the requirement of physical and chemical compatibility between the conductive layer and insulating layer with different material fabricated, especially at high temperature for a long time co-firing processes.…”

Section: Introductionmentioning

confidence: 99%

Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Liu

Jian²,

Yucai

et al. 2020

Mater. Res. Express

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In this paper, the silver paste was prepared by highly dispersed spherical silver powders with an average particle size of 0.85 um. The silver conductive thick films were printed on Al 2 O 3 and dielectric layer by screen-printing, the dielectric layer had been heat-treated differently, one was dried, the other fired. The corresponding sintering behaviors, electrical and mechanical properties of silver films were investigated systematically. Besides, we made a chip resistor to test performance. The results show that the silver conducting film on fired dielectric is compact, uniform and defect-free, the resistivity and adhesion are 2.54 uΩ·cm and 20.3 N mm −2 respectively. With the increase of sintering times, the conductivity of silver films on the fired dielectric layer increases first and then decreases, while the adhesion increases continuously. We proposed that the diffusion quantity of glasses from the dielectric layer to the surface was the key step in the period of the properties of silver films. The silver film on the fired dielectric layer has better applications in the high current chip resistors.

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Section: Introductionmentioning

confidence: 99%

Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Liu

Jian²,

Yucai

et al. 2020

Mater. Res. Express

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“…The amount of the heat flux is growing up by the improvement of chip integration, package density, small size, layer quality, high frequency and high power loss in small area [3][4]. The electronic devices used in power electronic applications have to work properly in a very wide temperature range up to 200…”

Section: Introductionmentioning

confidence: 99%

“…The main advantage of LTCC substrate with integrated liquid cooling system is the heat dissipation from the point of the thermal source. These devices therefore provide an excellent thermal performance for high power application with theoretical heat flux of 1000 W/cm 2 [2][3]. Moreover, the LTCC devices may not be bonded to a metal heat sink, which reduces the process steps, material, weight and volume that means less process steps within production.…”

Section: Introductionmentioning

confidence: 99%

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Pietriková

Girasek

Lukács

et al. 2017

Journal of Electrical Engineering

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The aim of this paper is detailed investigation of thermal resistance, flow analysis and distribution of coolant as well as thermal distribution inside multilayer LTCC substrates with embedded channels for power electronic devices by simulation software. For this reason four various structures of internal channels in the multilayer LTCC substrates were designed and simulated. The impact of the volume flow, structures of channels, and power loss of chip was simulated, calculated and analyzed by using the simulation software Mentor Graphics FloEFD TM . The structure, size and location of channels have the significant impact on thermal resistance, pressure of coolant as well as the effectivity of cooling power components (chips) that can be placed on the top of LTCC substrate. The main contribution of this paper is thermal analyze, optimization and impact of 4 various cooling channels embedded in LTCC multilayer structure. Paper investigate, the effect of volume flow in cooling channels for achieving the least thermal resistance of LTCC substrate that is loaded by power thermal chips. Paper shows on the impact of the first chips thermal load on the second chip as well as. This possible new technology could ensure in the case of practical realization effective cooling and increasing reliability of high power modules.

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“…The amount of the heat flux is growing up by the improvement of chip integration, package density, small size, layer quality, high frequency and high power loss in small area [1,2]. The electronic devices used in power electronic applications have to work properly in a very wide temperature range up to 200°C.…”

Section: Introductionmentioning

confidence: 99%

“…LTCC is well suited as package solution for harsh environments due to their inherent features such as excellent thermal and chemical stability, hermeticity, simple 3D structuration, matching of thermal expansion coefficient with silicon and possibility of different fluidic and electrical component integration inside one ceramic substrate [3,10,11]. These interesting features can be used in different applications of industry, where is the necessity to cooling the devices by the coolant inside the microfluidic system [1,2,4,5,7,9].…”

Section: Introductionmentioning

confidence: 99%

Simulation of Heat Transfer by Cooling Channels in LTCC Substrate

Girasek¹,

Pietriková²,

Welker³

et al. 2017

AEI

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The thermal resistance, flow analysis, pressure drop and distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) substrate are detailed investigated in this paper. For this reason four various structures of internal channels in the multilayer LTCC substrates were designed and simulated. The simulation 3D model consist of 6 LTCC of DuPont 951 ® layer with cooling microchannel in middle of substrate, power chips paced on top of LTCC and silver sintered joints under power chips. The impact of the structure of channels, volume flow and power loss of die was simulated, calculated and analyzed by using the simulation software Mentor Graphics FloEFD TM. The structure and size of channels have the significant impact on thermal resistance, pressure of coolant as well as the effectivity of cooling power components which can be placed on LTCC substrate. The thermal resistance was calculated from the temperature gradient among chip junction, the inlet fluid and the thermal load of chip. Optimizing and comparison of cooling channels structure inside LTCC substrates and analyzing the effect of volume flow for achieving the least thermal resistance of LTCC multilayer substrate is the main contribution of this paper.

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Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate

Cited by 46 publications

References 36 publications

Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Simulation of Heat Transfer by Cooling Channels in LTCC Substrate

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Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate

Cited by 46 publications

References 36 publications

Research of microscale silver particle paste on Al2O3, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Research of microscale silver particle paste on Al2O3, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Simulation of Heat Transfer by Cooling Channels in LTCC Substrate

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Product

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Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process

Research of microscale silver particle paste on Al₂O₃, pre-dried dielectric layer and pre-fired dielectric layer substrate by a co-firing process