2011
DOI: 10.1007/978-3-642-13864-5_3
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Flow stress of light metal alloys

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Cited by 2 publications
(6 citation statements)
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“…These results indicate that the addition of Cu gradually enhances the deformation resistance of the dilute Al-Fe-Si alloy. As Cu has a relatively high solid solubility in aluminum (5.7% at 548 °C [ 6 ]), all of the added Cu up to 0.31% is expected to be in the solid solution after homogenization and at the deformation temperature. Microstructural examination of the Cu-containing deformed samples confirmed that Cu did not form any precipitates or dispersoids and that all of the added Cu remained in solid solution (Figures not shown here—more detailed information in Ref.…”
Section: Resultsmentioning
confidence: 99%
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“…These results indicate that the addition of Cu gradually enhances the deformation resistance of the dilute Al-Fe-Si alloy. As Cu has a relatively high solid solubility in aluminum (5.7% at 548 °C [ 6 ]), all of the added Cu up to 0.31% is expected to be in the solid solution after homogenization and at the deformation temperature. Microstructural examination of the Cu-containing deformed samples confirmed that Cu did not form any precipitates or dispersoids and that all of the added Cu remained in solid solution (Figures not shown here—more detailed information in Ref.…”
Section: Resultsmentioning
confidence: 99%
“…The increase in flow stress with the addition of Cu is attributed to the solid solution strengthening effect of Cu, which is a result of interactions between the mobile dislocations and the solute atoms. The presence of Cu solutes increases the high-temperature flow stress and decreases the dynamic recovery rate due to the solute drag effect on dislocation movement [ 6 , 29 , 30 , 31 ]. With an increase in Cu content, the Cu solutes produced a stronger solute-drag effect and further decreased the dynamic recovery level and subsequently increased flow stress.…”
Section: Resultsmentioning
confidence: 99%
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“…This result can be attributed to the higher solid solubility of Cu and Mg in aluminum, which is approximately 0.4% and 1.7% at room temperature, respectively. 18 Therefore, all of the additions of Cu up to 0.29% and Mg up to 0.1% in this study are expected to remain in the solid solution after extrusion. To understand the microstructure evolution with the additions of Cu and Mg in 8xxx aluminum alloys, EBSD orientation maps of the same typical alloy samples as in Fig.…”
Section: Microstructure Evolutionmentioning
confidence: 88%
“…1) has a linear relation with Fe concentration (CFe). 18 Hence, the particle contribution ρpfp in Eq. 1 can be substituted by , in which is treated as the resistance parameter of Fe alloying element.…”
Section: Electrical Conductivity and Tensile Strengthmentioning
confidence: 99%