Floor plan design for 3D multi-layer substrate

Ko, Ching-Mai; Huang, Yu-Jung; Fu, Shen–Li

doi:10.1109/impact.2009.5382285

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2009

DOI: 10.1109/impact.2009.5382285

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Floor plan design for 3D multi-layer substrate

Ching-Mai Ko

Yu-Jung Huang

Shen–Li Fu

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Floor plan design for 3D multi-layer substrate

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References 11 publications

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