Handbook of Crystal Growth 2015
DOI: 10.1016/b978-0-444-63303-3.00007-9
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Floating Zone Growth of Silicon

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Cited by 16 publications
(8 citation statements)
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“…With larger depth of the crystallization interface and therefore smaller interface angle, in general an increase of thermal stress is expected. Von Mises stress invariant is commonly used as a universal measure for the stress impact on dislocation generation and fracture [3]. Influence of the ridge and process parameters on von Mises stress on the crystal surface is shown in Fig.…”
Section: Calculation Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…With larger depth of the crystallization interface and therefore smaller interface angle, in general an increase of thermal stress is expected. Von Mises stress invariant is commonly used as a universal measure for the stress impact on dislocation generation and fracture [3]. Influence of the ridge and process parameters on von Mises stress on the crystal surface is shown in Fig.…”
Section: Calculation Resultsmentioning
confidence: 99%
“…However, currently the ingot diameter is limited to 200 mm with the two main impediments being the crystal fracture due to thermal stress with related dislocation generation and electrical breakdown at the inductor main slit [3]. One of the first reported calculations of thermal stress in the silicon crystal during FZ growth was part of a global axis-symmetric quasi-steady model including electromagnetic field and heat transfer for a 4" crystal diameter [4].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the operator must form a certain shape in which the crystal diameter is first reduced (called "necking") and then increase the diameter of the crystal to obtain a single crystal. Since the dynamics of the melt state depending on the input parameters are non-linear and complicated, it is difficult to simulate the FZ crystal growth process, as has been achieved for other crystal growth methods [29][30][31][32][33] . Thus, it is necessary to predict the dynamics of FZ crystal growth from the operation trajectories.…”
Section: Introductionmentioning
confidence: 99%
“…Floating zone method is a promising technique to growth single crystals with the advantage of containerless environment, which is widely used for the growth of high-precision silicon, super alloys and other semiconductor material [1][2][3]. Marangoni convection driven by surface tension gradient has a dramatic effect on distribution of impurity concentration in melt, due to existence of free surface in floating zone growth system [4,5].…”
Section: Introductionmentioning
confidence: 99%