Abstract:The high cost and undesirable bulky packages have been and continues to be major stumbling blocks in commercializing MEMS products. Flip chip technologies are very promising techniques for MEMS packaging. This paper presents a brief introduction of flip chip technologies as well as examples of successful applications of flip chip technologies in MEMS (e.g. RF and optical MEMS, micro sensors) packaging. The result shows that, although MEMS packaging is much more complicated than that for microelectronics, flip … Show more
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