Flip chip on board mounting processes using anisotropic conductive adhesives and eutectic solder

Flip chip assemblies using gold bumps and adhesive

“…Many simple, low cost and low-temperature processes for flip chip assemblies have been developed (Lau, 1995;Kloeser et al, 1997;Zhong, 1999;Zhong et al, 1997) since the C4 (controlled collapse chip connection) process was invented over 35 years ago. There are now many options to select from for a particular application of flip chip technology.…”

“…The shear strength was calculated by dividing the load measured by the adhesive area where failure occurred. Because the same adhesive material was used in ACFs B, C and D but with different conductive particles, only ACF C was evaluated by the shear tests together with ACFs A, E and F. The results of the shear tests are shown in Figure 3 (Zhong et al, 1997).…”

Assembly issues in three flip chip processes

“…Besides the C4 (controlled collapse chip connection) process invented over 30 years ago, many simpler, lower cost and lower-temperature processes for flip chip assemblies have been developed (Lau, 1995;Zhong et al, 1997;Zhong and Goh, 1999;Kloeser et al, 1997). In other words, nowadays electronics packaging engineers have many more choices to select a flip chip assembly process for a particular application than they used to do.…”

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

“…Another reason is the increased availability of the lower-cost bonding and encapsulation materials, bumped bare dies, substrate, and equipment. Also, besides the C4 process, other processes have been developed (Lau, 1995;Zhong et al, 1997;Boustedt and Vardaman, 1997;Lyn et al, 1997;Kloeser et al, 1997;Johnson et al, 1997;Neiro et al, 1997;Beddingfield, 1997;Jimarez et al, 1997;Schiebel, 1997;Riley, 1997;Savolainen, 1998).…”