Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Pao, C.K.; Wong, Wa; Gray, W.D.; Liu, C.; Wang, D.C.; Wen, Cheng P.

doi:10.1109/epep.1993.394598

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“…We fabricated coplanar waveguide structures using technology similar to that of [6] and [SI. The subsirate was 625 pm GaAs.…”

Section: Fabricationmentioning

confidence: 99%

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Microwave characterization of flip-chip MMIC components

Marks¹,

Jargon²,

Pao³

et al.

1995 Proceedings. 45th Electronic Components and Technology Conference

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“…We fabricated coplanar waveguide structures using technology similar to that of [6] and [SI. The subsirate was 625 pm GaAs.…”

Section: Fabricationmentioning

confidence: 99%

“…Flip-chip mounting, a natural packaging technique for coplanar waveguide components, has recently come into use [6,7,8]. The process has the potential for low-cost, highyield, high-volume applications.…”

Section: Introductionmentioning

confidence: 99%

Microwave characterization of flip-chip MMIC components

Marks¹,

Jargon²,

Pao³

et al.

1995 Proceedings. 45th Electronic Components and Technology Conference

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show abstract

Microwave characterization of flip-chip MMIC interconnections

Marks¹,

Jargon²,

Pao³

et al.

Proceedings of 1995 IEEE MTT-S International Microwave Symposium

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We report accurate on-wafer measurements of transmission lines on flip-chip coplanar-waveguide MMICs. The effects are difficult to predict theoretically, and, without custom standards and unique calibration software, measurements would be intractable. The results are applicable to the development of an accurate CAD database. We also repolt and apply a new technique for the measurement of transmission line capacitance.

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Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Cited by 2 publications

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Microwave characterization of flip-chip MMIC components

Microwave characterization of flip-chip MMIC components

Microwave characterization of flip-chip MMIC interconnections

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